封裝外形 的英文怎麼說

中文拼音 [fēngzhuāngwàixíng]
封裝外形 英文
package outline
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 外 : Ⅰ名詞1 （外面） outside; external side 2 （外國） foreign country 3 （以外） besides; beyond; in ...
  • 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
  1. Up - down bisection is an arc, horizontal type. innovative insert plates and fixing bolts are used to fix and seal fosc, and its installation is quite simple

    光纜接頭盒外形按弧線型臥式結構設計，上下對開，整體採用創新的插板卡緊結構和少量螺釘固定密封，安裝極為方便。
  2. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack

    半導體器件的機械標準化.表面安裝半導體器件封裝外形圖繪制一般規則.玻璃密封陶瓷方型扁平封裝設計指南
  3. G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for glass sealed ceramic quad flatpack

    半導體器件的機械標準化.第6 - 8部分:表面安裝半導體器件封裝外形圖繪制的一般規則.玻璃密封的陶瓷四邊形扁平組件的設計指南
  4. Mechanical standardization of semiconductor devices - part 6 - 12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch land grid array ; rectangular type

    半導體器件的機械標準化.第6 - 12部分:表面安裝半導體器件封裝外形圖繪制的一般規則.小節距柵極矩陣列的設計指南
  5. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for gull - wing lead terminals

    半導體器件的機械標準化.表面安裝的半導體器件封裝外形圖繪制的一般規則.海鷗翼式鉛端子的設計指南
  6. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitchball grid array

    半導體器件機械標準化.表面安裝半導體器件封裝外形圖繪制的一般規則.小螺距球柵陣列的設計指南
  7. Mechanical standardization of semiconductor devices - part 6 - 3 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; measuring methods for package dimensions of quad flat packs

    半導體器件的機械標準化.第6 - 3部分:表面安裝半導體器件封裝外形圖繪制的一般規則.四面扁平部件封裝尺寸的測量方法
  8. Flag. mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine pitch land grid array - proposed amendment on terminology

    半導體器件的機械標準化.表面安裝半導體器件封裝外形圖繪制的一般規則.小爆距紋間表面網格陣列
  9. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for 1, 50 mm, 1, 27 mm and 1, 00 mm pitch ball and column terminal packages

    半導體裝置的機械標準化.表面安裝的半導體裝置封裝外形圖繪制的一般規則. 1 . 5mm 1 . 27mm和1 . 00mm樹脂球和引線端子封裝的設計指南
  10. Mechanical standardization of semiconductor devices - part 6 - 2 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for 1, 50 mm, 1, 27 mm and 1, 00 mm pitch ball and column terminal packages

    半導體器件的機械標準化.第6 - 2部分:繪製表面安裝半導體器件封裝外形圖的一般規則. 1 . 5mm 1 . 27mm和1 . 00mm樹脂球和引線端子封裝的設計指南
  11. Mechanical standardization of semiconductor devices - coding system and classification into forms of package outlines for semiconductor device packages

    半導體器件的機械標準化.半導體器件封裝外殼形式的分類和編碼系統
  12. Mechanical standardization of semiconductor devices - part 4 : coding system and classification into forms of package outlines for semiconductor device packages

    半導體器件的機械標準化.第4部分:半導體器件封裝外殼形式的分類和編碼系統
  13. Mechanical standardization of semiconductor devices - part 4 : coding system and classification into forms of package outlines for semiconductor device packages ; amendment 2

    半導體器件的機械標準化.第4部分:半導體器件封裝外殼形式的分類和編碼系統.修改件2
  14. Mechanical standardization of semiconductor devices - part 4 : coding system and classification into forms of package outlines for semiconductor device packages ; amendment 1

    半導體器件的機械標準化.第4部分:半導體器件封裝外形圖類型的劃分和編號系統.修改件1
  15. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages

    半導體器件的機械標準化.表面安裝半導體器件封裝外形圖繪制的一般規則
  16. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - dimensions of p - vson

    半導體器件的機械標準化.表面安裝半導體器件封裝外形圖繪制的一般規則. p - vson的尺寸
  17. Mechanical standardization of semiconductor devices - part 6 - 10 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - dimensions of p - vson

    半導體器件的機械標準化.第6部分:表面安裝半導體器件封裝外形圖繪制的一般規則. p - vson的尺寸
  18. Mechanical standardization of semiconductor devices - part 6 - 10 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; dimensions of p - vson

    半導體器件的機械標準化.第6 - 10部分:表面安裝半導體器件封裝外形圖繪制的一般規則. p - vson的尺寸
  19. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of ball grid array

    半導體器件的機械標準化.繪製表面安裝半導體器件封裝外形圖的一般規則.焊球網格陣列封裝尺寸的測量方法
  20. Bga mechanical standardization of semiconductor devices - part 6 - 4 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of ball grid array

    半導體裝置的機械標準化.第6 - 4部分:表面安裝半導體裝置封裝外形圖繪制的一般規則.球狀網格陣列
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