方形扁平封裝 的英文怎麼說

中文拼音 [fāngxíngbiǎnpíngfēngzhuāng]
方形扁平封裝 英文
qf quad flat pack
  • 方 : Ⅰ名詞1 （方形; 方體） square 2 [數學] （乘方） involution; power 3 （方向） direction 4 （方面） ...
  • 扁 : 扁形容詞[書面語]1. （形體小的） small2. （邊遠的） out-of-the-way
  • 平 : Ⅰ形容詞1 （沒有高低凹凸 不頃斜） flat; level; even; smooth 2 （高度相同; 不相上下） on the same l...
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 方形 : square; tetragonum
  • 扁平 : flat
  • 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
  1. Chip carrier sockets for plastic quad flat packages for use in electronic equipment, blank detail specification for

    電子設備用塑料方形扁平封裝用片式載體插座的空白詳細規范
  2. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack

    半導體器件的機械標準化.表面安裝半導體器件封裝外形圖繪制一般規則.玻璃密封陶瓷方型扁平封裝設計指南
  3. A new method for calculating the strain energy release rate of delamination crack propagation at an interface between dissimlar materials was suggested by using the j - integral with a small flat rectangular contour near the crack tip

    提出了一種通過特定的扁平小矩形路徑j積分，計算電子封裝中異質界面分層裂縫擴展能量釋放率的新方法。
  4. Mechanical standardization of semiconductor devices - part 6 - 3 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; measuring methods for package dimensions of quad flat packs

    半導體器件的機械標準化.第6 - 3部分:表面安裝半導體器件封裝外形圖繪制的一般規則.四面扁平部件封裝尺寸的測量方法
  5. Because the calculation of j - integral is much simpler than other method, and the multilayers and interfaces are ubiquitous in microelectronic packaging structures, it is expected that this method will be widely used in the calculation of the strain energy release rate in high density electrical packaging, especially

    並通過實例證明，此新方法對于界面分層問題是可行的。由於j積分計算十分簡便，因此扁平小矩形路徑j積分方法有望在電子封裝分層能量釋放率計算中得到廣泛的應用。
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