最大填充率 的英文怎麼說
中文拼音 [zuìdàtiánchōnglǜ]
最大填充率
英文
peak filling rate-
Beginning with the analysis of the effects, which are brought by the application of only one kind of pore - former and some other operating factors ( such as sintering temperature, warmth retaining time and so on ), on the properties of the beads, e. g., porosity, strength, size distribution of the beads and pores size, etc., these effects are discussed in detail and the relationship between the factors is studied thoroughly. the use of mpf ( multi - pore - former ) is introduced for the first time, which is of the most importance and significance in this paper
研究從造孔劑選用和燒結過程對顆粒的孔隙率、機械強度、孔徑分佈及粒度分佈的影響入手，找出了造孔劑的種類及含量、燒結溫度以及保溫時間等因素對最終所得產品顆粒的性能影響及它們之間的相互關系，並首次提出將造孔劑復配使用來對填充法加以改進，無需擴孔處理，即能直接制備宏孔徑、高強度、小粒度、比表面大的多孔玻璃載體顆粒。In the second part, the reliability research on electronic packaging was concentrated with finite element method ( fem ) on moisture diffusion in plastic materials, die cracking of flip - chip with no - flow underfill and thermal performance of high power electronic components. in the last chapter, the design tool for advanced electronic package was studied. the main conclusions in the second part are as follows
論文第二部分電子封裝可靠性研究包含對塑封材料中水汽擴散研究、填充不流動膠的倒裝焊晶元可靠性研究以及大功率器件散熱問題研究三方面內容，最後為實現封裝設計標準化和自動化，研究了若干最主要的電子封裝構型的參數化有限元建模、加載和相應的求解方法。
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