無鉛製程 的英文怎麼說

中文拼音 [qiānzhìchéng]
無鉛製程 英文
rohs
  • : 無Ⅰ動詞(沒有) not have; there is not; be without Ⅱ名詞1 (沒有) nothing; nil 2 (姓氏) a surn...
  • : 鉛名詞1. (金屬元素) lead (pb) 2. (鉛筆心) lead (in a pencil); black lead
  • : 名詞1 (規章; 法式) rule; regulation 2 (進度; 程序) order; procedure 3 (路途; 一段路) journe...
  • 無鉛 : lead free
  1. No. 1 market share in japan for lead free soldering equipment as n2 / air reflow, n2 / air wave soldering system & spray fluxer. we also can provide soldering chemical materials

    全日本銷售和佔有第一,無鉛製程設備如氮氣?空氣回焊爐,氮氣?空氣波峰焊爐等。我們也提供錫膏,電子化學材料等。
  2. In the transition from lead to lead - free, for the manufacturers of electronic products, there is expected to be a period when lead and lead - free materials will be used within the same mounting process, the mixed solder joint which formed in this situation is very complicated

    摘要在從有轉換過中,電子產品造商不可避免會碰到同一組裝過中有同時存在的混合情況,這種情況下形成的混合焊點是很復雜的。
  3. Made without using lead oxide as tradional way, avoiding hurtful lead element, but increasing the content of zinc, a trace element helpful to human body

    作過中不用氧化,使用先進行工藝加工而成,免除了有害素,增加了對人體有益的微量鋅素色澤鮮艷、進口醇香、宴請佳肴、饋贈禮品。
  4. Lead free procedure panasonic module super hi - speed mounting machine assembly line x 3

    無鉛製程的松下模塊化高速貼片機生產線x 3
  5. Development of manufacturability and reliability model on the pb free eletronic products

    電子產業無鉛製程及可靠性實驗模式的開發
  6. Development of manufacturability and reliability model on the pb free electronic products

    電子產業無鉛製程及可靠性實驗模式的開發
  7. According to recognition of solder fog, can assist with determination of lead - free process ( on the certification )

    透過錫霧狀況辨別,可輔助無鉛製程之判定(功能認證中) 。
  8. More than 3 years working experiences in smt processing and strong willing to be a technical sales in selling lead - free solder paste

    3年以上smt生產線工藝控制經驗,具有銷售錫膏產品的願望。
  9. The manufacturability and reliability problems involved during the lead - free transfer process and transition stage were discussed, including its influence on the components / devices, pcb and solder alloy and the compatibility problems

    摘要闡述了在轉移過中涉及的可造性與可靠性問題,包括轉移對元器件、印電路板與焊點的影響以及它們相互之間的兼容問題。
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