玻璃纖維包板 的英文怎麼說

中文拼音 [xiānwéibāobǎn]
玻璃纖維包板 英文
fibreglass sheathing
  • : 纖形容詞(細小) fine; minute
  • : Ⅰ動詞1 (連接) tie up; hold together; link 2 (保持; 保全) maintain; safeguard; preserve; keep ...
  • : Ⅰ名詞1 (片狀硬物體) board; plank; plate 2 (專指店鋪的門板) shutter 3 [音樂] (打拍子的樂器) ...
  • 玻璃 : 1. (一種質地硬而脆的透明物體) glass 2. [口語] (指某些像玻璃一樣透明的尼龍、塑料等) nylon; plastic
  • 纖維 : fibre; staple; filamentary
  1. The produce process contains : fiberglass process, foam process, balsa process and layer press board process etc. the product range among : emulate slide flight, engine motor flight, electromotion flight, eject flight, airscrew and the accessory of various flight model

    翔華航模的生產工藝現有製作,泡沫塑料製作, balsa製作,層壓製作。產品括像真滑翔飛機,引擎動力飛機,電動飛機,噴射飛機以及螺旋槳和各種飛機模型配件。
  2. Specifications. specification no. 19. thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    規范.第19號規范:多層印製電路構件規定的可燃性雙馬來酰亞胺三嗪改型氧化物編織銅疊層
  3. Base materials for printed circuits - thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    印製電路用基體材料.用於多層印製構成的限定可燃性的薄雙馬來酰亞胺三嗪改性的環氧織物銅層壓
  4. Base materials for printed circuits. part 2 : specifications. specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test

    印刷電路用基材.第2部分:規范. 18號規范:規定易燃性的雙馬來酰亞胺三嗪改良型環氧化合物機織織物銅層壓
  5. Base materials for printed circuits. part 2 : specifications - specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test

    印刷電路用基材.第2部分:規范. 18號規范.規定易燃性的雙馬來酰亞胺三嗪改良型環氧化合物機織織物銅層壓
  6. To fuel further growth and profits, in tandem with an expansion plan in the pipeline, the group has been engineering steps to achieve notable sales of epoxy resin to outside parties in the near future

    環氧樹脂不單是生產環氧覆銅面的主要原料,此化工產品亦被廣泛應用於半導體裝接合劑塗層絕緣及建築行業。
  7. Materials for printed boards and other interconnection structures - part 2 - 19 : reinforced base materials, clad and unclad ; epoxide cross - plied linear fibreglass - reinforced laminated sheets of defined flammability vertical burning test, copper clad

    印製和其它互連結構用材料.第2 - 19部分:被和非被增強基材料.規定燃燒性的環氧交叉簾布層線性增強銅的疊層
  8. Based on the improved thermal prompting source, series of experiments about indt had been done. the material used in experiments include aluminium tole, aluminium honeycomb board, plastic sheet, cuniform aluminium honeycom, fiberglass complex material ect. the defect signal was distlled and analysed

    在此基礎上,對系列試件,括鋁金屬薄片、鋁蜂窩材、塑料薄、楔形鋁蜂窩、復合材料,進行不同缺陷的紅外無損檢測實驗,對缺陷信號進行了處理和分析。
  9. Materials for printed boards and other interconnecting structures - part 2 - 9 : reinforced base materials clad and unclad ; bismaleimide triazine modified epoxide or unmodified, woven e - glass reinforced laminated sheets of defined flammability vertical burning test, copper - clad

    印製和其它互連結構用材料.第2 - 9部分:被和非被增強基材.規定了易燃性的銅二順丁烯二酰亞胺三嗪改良或未改良的環氧編織e型增強層壓
  10. Materials for interconnection structures - sectional specification set for reinforced base materials, clad and unclad - reinforced base materials clad and unclad - bismaleimide triazine, modified epoxide or unmodified, woven e - glass reinforced laminated sheets of defined flammability vertical burning test, copper - clad

    互連結構用材料.被和非被增強基材分規范.被和非被增強基材.規定了易燃性的銅二順丁烯二酰亞胺三嗪改良或未改良的環氧編織e型增強層壓
  11. Materials for printed boards and other interconnecting structures - part 2 - 19 : reinforced base materials, clad and unclad - epoxide cross - plied linear fibreglass - reinforced laminated sheets of defined flammability vertical burning test, copper clad

    印製和其它互連結構用材料.第2 - 19部分:覆和不覆增強基材.規定易燃性的環氧交叉簾布層線性增強銅層壓
  12. Materials for printed boards and other interconnecting structures - part 2 - 7 : reinforced base materials clad and unclad - epoxide woven e - glass laminated sheet of defined flammability vertical burning test, copper - clad

    印製電路和其它互連結構件用材料.第2 - 7部分:覆和非覆的增強基材.規定易燃性的環氧編織e型層壓銅薄
  13. Materials for interconnection structures - sectional specification set for reinforced base materials, clad and unclad - polyester non - woven woven fibreglass laminated sheet of defined flammability vertical burning test, copper - clad

    互連結構用材料.層和非層增強的基材分規范.規定了易燃性的聚酯非編織編織的層壓
  14. Materials for printed boards and other interconnection structures - part 2 - 4 : reinforced base materials, clad and unclad ; polyester non - woven woven fibreglass laminated sheet of defined flammability vertical burning test, copper - clad

    印製和其它互連結構用材料.第2 - 4部分:被和非被增強基材.規定了易燃性的覆銅聚酯非編織編織層壓
  15. Materials for printed boards and other interconnecting structures - part 2 - 4 : reinforced base materials clad and unclad - polyester non - woven woven fibreglass laminated sheet of defined flammability vertical burning test, copper - clad

    印刷電路及其它互連結構用材料.第2 - 4部分:覆和不覆增強基材.規定易燃性的聚酯非機織機織銅層壓
  16. Base materials for printed circuits - part 2 : specifications - specification no 9 : epoxide cellulose paper core, epoxyde glass cloth surfaces copper - clad laminated sheet of defined flammability vertical burning test

    印刷電路用基材.第2部分:規范. 9號規范.規定易燃性的環氧化合物素紙芯環氧化合物布麵銅層壓
  17. Base materials for printed circuits. part 2 : specifications. specification number 9 : epoxide cellulose paper core, epoxyde glass cloth surfaces copper - clad laminated sheet of defined flammability vertical burning test

    印刷電路用基材.第2部分:規范. 9號規范:規定易燃性的環氧化合物素紙芯環氧化合物布麵銅層壓
  18. Base materials for printed circuits. part 2 : specifications - specification number 17 : thin polyimide oven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    印刷電路用基材.第2部分:規范. 17號規范:多層印刷電路製作用規定易燃性的聚酰亞胺機織織物銅層壓
  19. Materials for printed boards and other interconnecting structures - part 2 - 10 : reinforced base materials clad and unclad - cyanate ester, brominated epoxide, modified or unmodified, woven e - glass reinforced laminated sheets of defined flammability vertical burning test, copper - clad

    印製電路和其它互連結構用材料.第2 - 10部分:覆和非覆的增強基材.規定可燃性的銅改性的或未改性的氰酸酯溴化環氧編織e型增強層壓薄
  20. On top of the expansion of in - house r & d capabilities, the group has also commissioned joint venture programmes with leading research centres, including the establishment of zhejiang university - kingboard polymer research centre in the year. new laminate products such as flame - retardant paper laminates and glass epoxy laminates for multi - layered pcbs were introduced during the year to capture new market demands

    除了擴大內部的研發設施,集團還與著名研究中心共同研究合作項目,其中括于年度內成立的浙江大學建滔高分子研究中心。為配合市場需要,集團已於年內推出絕緣性能較佳的環保防火紙覆銅面( fr2 )及供多層印刷電路用的薄覆銅面
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