砂輪轉速 的英文怎麼說

中文拼音 [shālúnzhuǎnsù]
砂輪轉速 英文
grinding wheel speed
  • 砂 : 名詞（沙子） sand; grit
  • 輪 : Ⅰ名1 （輪子） wheel 2 （像輪子的東西） wheel like object; ring; disc 3 （輪船） steamer; steamboa...
  • 轉 : 轉構詞成分。
  • 速 : Ⅰ形容詞（迅速; 快） fast; rapid; quick; speedy Ⅱ名詞1 （速度） speed; velocity 2 （姓氏） a surna...
  • 轉速 : speed; revolution; rotation rate; speed of revolution; rotating speed; rotational speed轉速指示器...
  1. Maximum operating speed of grinding wheels

    砂輪最大運轉速度
  2. Grinding wheel continues with an infinite number of hard, sharp and refractory grits on edge surface at a high speed of swing operation to cut and grind over the surface of work piece, and unceasing self - sharpening grains and pore continue to grind a tool for every kind of material

    砂輪是經由高速回轉運作中，以其在外緣表面植無數上千萬之硬銳耐溫之小磨粒連續在工作物表面切削磨除，且不斷的自生銳利顆粒與磨屑空隙氣孔，繼續對各種材料做磨削工作的一種研磨工具。
  3. Grinding feature is to use work piece for a slow - speed operation, and wheel spindle selects a high - speed revolution and offers a minor amount of in - feed to cooperate with mechanical spinde for forward and backward movement for finishing grinding jobs

    研磨特性是利用工作物做慢速運轉，而砂輪心軸采高速回轉並給予微量進刀配合機械心軸前後運動完成研磨作業。
  4. Under function of impeller with high rotating speed, the used sand will be cast to the wearable junk ring to remove the inert film on surface of the sand via mutual collision and friction between sand and junk ring, impeller and case of machine, sand and sand

    工作時舊砂在高速回轉的葉輪作用下，拋向耐磨襯圈，通過砂粒與襯圈葉輪與機盒砂粒與砂粒之間的相互碰撞和摩擦，去除砂粒表面的樹脂惰性膜。
  5. Abstract : the effect factors of grinding roller surface roughness areanalyzed and experimented. the law of effect factors such as roller rotary speed, grinding wheel granularity, grinding liquid and so on, about roller surface roughness is obtained. the mathematical model of roughness is established through regression

    文摘:對影響磨削輥面粗糙度的因素進行了系統分析和實驗研究，得出了軋輥轉速、砂輪速度、砂輪粒度、磨削液等因素對磨削輥面粗糙度影響的一般規律，利用回歸分析的方法建立了粗糙度的數學模型。
  6. The results show that, when increasing the feed rate of the grinding wheel, decreasing the rotating speed of the wafer chuck table and using coarser grit grinding wheel, the material removal rate in the wafer rotating grinding increase, the feed rate of the grinding wheel has greater influence on the material removal rate ; when suitably increasing the rotating speed of the grinding wheel, decreasing the feed rate of the grinding wheel and using finer grit grinding wheel, the wafer surface roughness can be reduced ; there exists a critical rotating speed of the grinding wheel ( about 2300rpm ), beyond which the material removal rate evidently decreases and the spindle motor current and wafer surface roughness steeply increase ; when the grit size of the grinding wheel is finer than # 2000, the material removal rate decreases and the wafer surface roughness has no obvious improvement

    研究結果表明，增大砂輪軸向進給速度和減小工件轉速，採用粗粒度砂輪有利於提高磨削矽片的材料去除率，砂輪軸向進給速度對材料去除率的影響最為顯著；適當增大砂輪轉速，減小砂輪軸向進給速度，採用細粒度砂輪可以減小磨削表面粗糙度；在其它條件一定的情況下，砂輪速度超過一定值會導致材料去除率減小，主軸電機電流急劇增大，表面粗糙度變差；採用比# 2000粒度更細的砂輪磨削時，材料去除率減小，矽片表面粗糙度沒有明顯改善。
  7. By using a wafer - rotating grinding machine, the influence of the main process factors including grit size of diamond grinding wheel, rotating speed of the wafer chuck table, rotating speed and the down feed rate of the cup grinding wheel on the material removal rate, spindle motor current and wafer surface roughness in grinding large size wafer are experimentally investigated

    摘要利用基於自旋轉磨削原理的矽片超精密磨床，通過試驗研究了砂輪粒度、砂輪轉速、工件轉速及砂輪進給速度等主要因素對材料去除率、砂輪主軸電機電流以及磨削后矽片表面粗糙度的影響關系。
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