表面安裝器件 的英文怎麼說

中文拼音 [biǎomiànānzhuāngqìjiàn]
表面安裝器件 英文
smd surface mount device
  • 表 : Ⅰ名詞1 （外面;外表） outside; surface; external 2 （中表親戚） the relationship between the child...
  • 面 : Ⅰ名詞1 （頭的前部; 臉） face 2 （物體的表面） surface; top 3 （外露的一層或正面） outside; the ri...
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 器 : 名詞1. （器具） implement; utensil; ware 2. （器官） organ 3. （度量; 才能） capacity; talent 4. （姓氏） a surname
  • 件 : Ⅰ量詞（用於個體事物） piece; article; item Ⅱ名詞1. （指可以一一計算的事物） 2. （文件） letter; correspondence; paper; document
  • 表面 : surface; superficies; boundary; face; rind; sheet; skin; outside; appearance
  1. Mechanical standardization of semiconductor devices - part 6 - 1 : general rules for the preparation of outline drawings of surface mounted semiconductor device parkages - design guide for gull - wing lead terminals

    半導體器件的機械標準化.第6 - 1部分:半導體器件包裝用表面安裝略圖制備的一般規則.鷗型翼引線終端的設計指南
  2. Surface mounting technology part 2 : transportation and storage conditions of surface mounting devices - application guide

    表面安裝技術第2部分：表面安裝元器件的運輸和貯存條件-應用指南
  3. Surface mounted piezoelectric devices for frequency control and selection - standard outlines and terminal lead connections - hybrid enclosure outlines

    頻率控制和選擇用表面安裝的壓電器件.標準外形和端頭連接器.混合外殼輪廓圖
  4. Surface mounted piezoelectric devices for frequency control and selection - standard outlines and terminal lead connections - part 4 : hybrid enclosure outlines

    頻率控制和選擇用表面安裝的壓電器件.標準外形和端頭連接器.第4部分:混合外殼輪廓圖
  5. Mechanical standardization of semiconductor devices - part 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages

    半導體器件的機械標準化.第6部分:表面安裝半導體器件封裝輪廓圖繪制的一般規則
  6. Mechanical standardization of semiconductor devices - part 6 - 5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch ball grid array

    半導體器件的機械標準化.第6 - 5部分:表面安裝半導體器件外殼外形圖繪制的一般規則.小螺距刃片柵格排列的設計指南
  7. Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine pitch land grid array

    半導體器件的機械標準化.第6 - 6部分:半導體器件包裝用表面安裝略圖制備的一般規則.小螺距刃片柵格排列的設計指南
  8. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack

    半導體器件的機械標準化.表面安裝半導體器件封裝外形圖繪制一般規則.玻璃密封陶瓷方型扁平封裝設計指南
  9. G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack

    半導體器件的機械標準化.第6 - 8部分:半導體器件包裝用表面安裝略圖制備的一般規則.玻璃密封的陶瓷四方塊的設計指南
  10. G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for glass sealed ceramic quad flatpack

    半導體器件的機械標準化.第6 - 8部分:表面安裝半導體器件封裝外形圖繪制的一般規則.玻璃密封的陶瓷四邊形扁平組件的設計指南
  11. Mechanical standardization of semiconductor devices - part 6 - 12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch land grid array ; rectangular type

    半導體器件的機械標準化.第6 - 12部分:表面安裝半導體器件封裝外形圖繪制的一般規則.小節距柵極矩陣列的設計指南
  12. This document provides smd manufacturers and users with standardized methods for handling, packing, shipping and use of moisture / reflow sensitive smds

    本標準提供smd生產商和使用者對濕氣/迴流敏感表面安裝器件的操作、包裝、運輸和使用的標準方法。
  13. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for gull - wing lead terminals

    半導體器件的機械標準化.表面安裝的半導體器件封裝外形圖繪制的一般規則.海鷗翼式鉛端子的設計指南
  14. Surface mounted piezoelectric devices for frequency control and selection - standard outlines and terminal lead connections - metal enclosures

    頻率控制和選擇用表面安裝的壓電器件.標準外形和終端引線連接.金屬外殼
  15. Surface mounted piezoelectric devices for frequency control and selection - standard outlines and terminal lead connections - part 3 : metal enclosures

    頻率控制和選擇用表面安裝的壓電器件.標準外形和終端引線的連接.第3部分:金屬外殼
  16. Surface mounted piezoelectric devices for frequency control and selection - standard outlines and terminal lead connections - part 2 : ceramic enclosures

    頻率控制和選擇用表面安裝的壓電器件.標準外形和終端引線的連接.第2部分:陶瓷外殼
  17. Surface mounted piezoelectric devices for frequency control and selection - standard outlines and terminal lead connections - plastic moulded enclosure outlines

    頻率控制和選則用表面安裝的壓電器件.標準外形和終端引線的連接.塑性模壓外殼外形
  18. Semiconductor devices - mechanical and climatic test methods - part 30 : preconditioning of non - hermetic surface mount devices prior to reliability testing

    半導體器件.機械和氣候試驗方法.第30部分:可靠性試驗之前不氣密的表面安裝器件的預調試
  19. Semiconductor discrete device dimensions of outline and lead - frame for the surface mounting device

    半導體分立器件表面安裝器件外形尺寸及其引線框架尺寸
  20. Printed wiring boards - guide for the design and use of printed wiring boards : surface mounted devices

    印製電路板.第23部分:設計和使用導則:表面安裝器件規范
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