表面安裝設備 的英文怎麼說

中文拼音 [biǎomiànānzhuāngshèbèi]
表面安裝設備 英文
smd surface mount device
  • 表 : Ⅰ名詞1 （外面;外表） outside; surface; external 2 （中表親戚） the relationship between the child...
  • 面 : Ⅰ名詞1 （頭的前部; 臉） face 2 （物體的表面） surface; top 3 （外露的一層或正面） outside; the ri...
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 設 : Ⅰ動詞1 （設立; 布置） set up; establish; found 2 （籌劃） work out : 設計陷害 plot a frame up; fr...
  • 備 : Ⅰ動詞1 （具備; 具有） have; be equipped with 2 （準備） prepare; provide with; get ready 3 （防備...
  • 表面 : surface; superficies; boundary; face; rind; sheet; skin; outside; appearance
  • 設備 : equipment; device; facility; implementor; apparatus; installation; appointment; furnishing; setou...
  1. In - circuit testers can now also test for solder opens on surface - mounted devices ( smds ), a common manufacturing defect on boards with smds

    對于表面安裝設備來說，焊接開路是一個很普遍的製造缺陷，在線測試設備可以將其測試出來。
  2. Mechanical standardization of semiconductor devices - part 6 - 1 : general rules for the preparation of outline drawings of surface mounted semiconductor device parkages - design guide for gull - wing lead terminals

    半導體器件的機械標準化.第6 - 1部分:半導體器件包裝用表面安裝略圖制備的一般規則.鷗型翼引線終端的設計指南
  3. Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine pitch land grid array

    半導體器件的機械標準化.第6 - 6部分:半導體器件包裝用表面安裝略圖制備的一般規則.小螺距刃片柵格排列的設計指南
  4. G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack

    半導體器件的機械標準化.第6 - 8部分:半導體器件包裝用表面安裝略圖制備的一般規則.玻璃密封的陶瓷四方塊的設計指南
  5. 1 fixed capacitors for use in electronic equipment - sectional specification : fixed surface mount multilayer capacitors of ceramic dielectric, class 1

    電子設備用固定電容器.分規范:陶瓷介質的表面安裝多層固定電容器
  6. Fixed capacitors for use in electronic equipment - sectional specification - fixed surface mount multilayer capacitors of ceramic dielectric, class 2

    電子設備用固定電容器.分規范. 2級陶瓷介質的表面安裝多層固定電容器
  7. Fixed capacitors for use in electronic equipment - part 20 : sectional specification : fixed metallized polyphenylene sulfide film dielectric surface mount d. c. capacitors

    電子設備用固定電容器.第20部分:分規范:金屬化聚苯硫醚膜介質表面安裝直流片式固定電容器
  8. Fixed capacitors for use in electronic equipment - part 20 : blank detail specification : fixed metallized polyphenylene sulfide film dielectric surface mount d. c. capacitors - assessment level ez

    電子設備用固定電容器.第20部分:空白詳細規范:金屬化聚苯硫醚膜介質表面安裝直流片式固定電容器.評定水平ez
  9. Fixed capacitors for use in electronic equipment - part 23 : sectional specification - fixed surface mount metallized polyethylene naphthalate film dielectric dc capacitors

    電子設備用固定電容器.第23部分:分規范.表面安裝的金屬化聚乙烯苯二甲酸鹽膜介質直流固定電容器
  10. Fixed capacitors for use in electronic equipment - part 23 - 1 : blank detail specification - fixed surface mount metallized polyethylene naphthalate film dielectric dc capacitors - assessment level ez

    電子設備用固定電容器.第23 - 1部分:空白詳細規范.表面安裝的金屬化聚乙烯苯二甲酸鹽膜介質直流固定電容器.評定水平ez
  11. Mechanical standardization of semiconductor devices - part 6 - 5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitch ball grid array

    半導體器件的機械標準化.第6 - 5部分:半導體器件包裝用表面安裝略圖制備的一般規則.小螺距球面柵格排列的設計指南
  12. Surface mount equipment characterization

    表面安裝設備特性描述
  13. Smd. piezoelectric devices - preparation of outline drawings of surface - mounted devices for frequency control and selection - general rules

    壓電器件.頻率控制和選擇用表面安裝設備
  14. Mechnical standardization of semiconductor devices - part 6 - 2 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for 1, 50 mm, 1, 27 mm and 1, 00 mm pitch ball and column terminal packages

    半導體器件的機械標準化.第6 - 2部分:半導體器件包裝用表面安裝略圖制備的一般規則. 1 . 5 mm 1 . 27 mm和1 . 00 mm螺距球面和柱狀終端包的設計指南
  15. Smd : surface mount device

    表面安裝設備
  16. Preconditioning of nonhermetic surface mount devices prior to reliability testing

    可靠性試驗之前不密閉表面安裝設備的預調節
  17. Standard for handling, packing, shipping and use of moisture reflow sensitive surface mount devices

    表面安裝的濕度反流敏感設備的搬運包裝船運和使用標準
  18. Fixed resistors for use in electronic equipment - sectional specification - fixed surface mount resistor networks with individually measurable resistors

    電子設備用固定電阻器.分規范.帶可單獨測量電阻器的表面安裝固定電阻網路
  19. Fixed capacitors for use in electronic equipment - part 21 : sectional specification : fixed surface mount multilayer capacitors of ceramic dielectric, class 1

    電子設備用固定電容器.第21部分:分規范: 1級陶瓷介質的表面安裝固定多層電容器
  20. Fixed capacitors for use in electronic equipment - part 22 : sectional specification : fixed surface mount multilayer capacitors of ceramic dielectric, class 2

    電子設備用固定電容器.第22部分:分規范: 2級陶瓷介質的表面安裝多層固定電容器
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