要均勻到位 的英文怎麼說

中文拼音 [yāojūnyúndàowèi]
要均勻到位 英文
brush evenly
  • : 要動詞1. (求) demand; ask2. (強迫; 威脅) force; coerceⅡ名詞(姓氏) a surname
  • : Ⅰ形容詞(均勻) equal; even Ⅱ副詞(都; 全) without exception; all
  • : Ⅰ形容詞(均勻) even Ⅱ動詞1. (使均勻) even up; divide evenly 2. (分出一部分) spare
  • : Ⅰ名詞1 (所在或所佔的地方) place; location 2 (職位; 地位) position; post; status 3 (特指皇帝...
  1. Fortunately, the modern geodetic measurements such as the global positioning system ( gps ) technique can overcome the shortage of the geological and seismographic methods in the time dimension ; and yet, the coverage of the geodetic survey stations is not sufficient. as a result, it is necessary to employ numerical simulation to investigate the continuous deformation of the crust

    而以全球定系統( gps )等技術為主的大地測量方法彌補了地質和地震學方法在時間維上的不足,但大地測量方法存在測點覆蓋不足及測點地理分佈不的缺點,因此,連續的地殼形變場有必藉助數值模擬方法。
  2. From the practical results, the protection potentials and protection current densities meet the design requirements and are in accord with technical standards

    從實際運行的結果看,罐底板的保護電都達了設計求和標準規定,保護電分佈相當
  3. Wavelengths or scales of surface heterogeneity are less than 20km. simulation results show that cbls do reach a quasi - stationary state correspondent to specified surfaces, after a long enough evolution. in this transition process and after that, horizontal statistics, i. e. mean potential temperature and vertical heat - flux, show profiles little differences to those over homogeneous flat surface. main effect of surface heterogeneity is to increase kinetic energy in cbl and the increase concentrates in the direction of surface heterogeneity. the time of cbl spent to reach its first peak of mean kinetic energy,

    模擬結果表明,在充分長的時間后,邊界層達一種適合於地面條件的準定常態。這種準定常態和向其過渡的過程中,水平平的邊界層廓線性質,如平溫廓線垂直熱通量廓線等幾乎與平坦地面的結果相同,或差異極小。地面非性的主作用是使邊界層動能增大,並以地面非性變化方向的動能增加為主。
  4. At present, the problem in testing sheet resistance for micro - areas is that probes must be set up at the suitable locations by handwork. in order to know the wafer ' s impurity distributing, we need test many times, so will waste a lot of time. if the wafer ' s diameter would be 300mm, this problem will be more serious. in this paper, image analysis is introduced, through pre - processing and edge picking - up, the probe tips are recognized. then probe tips will be aligned respectively in two perpendicular directions through driving stepper motors. thus the distribution of sheet resistance for whole wafer is got by automatic testing and it offers information for detecting the impurity distribution and the diffusion uniformity

    這樣,完成200mm ( 8時)圓片雜質的擴散分佈需對許多圖形進行測試,需花費很長的時間,當測試300mm矽片時問題就更為突出。本文將圖象與視覺測量系統引入四探針測試系統中,對採集的原始探針圖像進行預處理、邊緣提取等操作,以便實現探針針尖的識別,然後由電機控制實現探針的自動定。這樣測試系統可以自動獲得全片的薄層電阻分佈,為超大規模集成電路檢測雜質分佈和擴散的性提供信息。
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