醛基纖維素 的英文怎麼說

中文拼音 [quánjīxiānwéisù]
醛基纖維素 英文
aldocellulose
  • 醛 : 名詞[化學] （有機化合物的一類） aldehyde
  • 纖 : 纖形容詞（細小） fine; minute
  • 維 : Ⅰ動詞1 （連接） tie up; hold together; link 2 （保持; 保全） maintain; safeguard; preserve; keep ...
  • 素 : Ⅰ形容詞1 （本色; 白色） white 2 （顏色單純） plain; simple; quiet 3 （本來的; 原有的） native Ⅱ名...
  • 纖維素 : [化學] cellulose
  • 纖維 : fibre; staple; filamentary
  1. Materials for printed boards and other interconnecting structures - reinforced base materials, clad and unclad - phenolic cellulose paper reinforced laminated sheets, economic grade, copper - clad

    印製板和其它互連結構用材料.包被和非包被增強基材.酚醛纖維素紙增強銅包被經濟級疊層板
  2. In this paper, polyvinyl - butyral ( pvb ) and methyl cellulose ( mc ) are chosen as chemical additives to amend the property of normal mortar, orthogonal tests of 96 pieces of shear specimens are carried out, then orthogonal analysis of test results is performed

    採用聚乙烯醇縮丁醛和甲基纖維素對普通砂漿做合理改性，進行了96個抗剪試件的正交試驗，並對試驗結果進行正交分析。
  3. Base materials for printed circuits. part 2 : specifications. specification number 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality

    印刷電路用基材.第2部分:規范. 2號規范:經濟質量的酚醛纖維素紙包銅層壓板
  4. Base materials for printed circuits ; part 2 : specifications ; specification 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality ; amendment 3

    印製電路用基材.第2部分:規范.第2號規范:酚醛纖維素紙覆銅層壓板，經濟質量.修改件3
  5. Base materials for printed circuits - part 2 : specifications - specification no. 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality ; amendment 5

    印製電路用基底材料.第2部分:規范.第2號規范:經濟質量的酚醛纖維素紙覆銅層壓板.修改件5
  6. Base materials for printed circuits. part 2 : specifications. specification number 14 : phenolic cellulose paper copper - clad laminated sheet of defined flammability vertical burning test, economic quality

    印刷電路用基材.第2部分:規范. 14號規范:經濟質量的規定易燃性的酚醛纖維素紙包銅層壓板
  7. Base materials for printed circuits - part 2 : specification - specifications number 14 : phenolic cellulose paper copper - clad laminated sheet of defined flammability vertical burning test, economic quality

    印刷電路用基材.第2部分:規范. 14號規范:經濟質量的規定易燃性的酚醛纖維素紙包銅層壓板
  8. . 5 base materials for printed circuits - part 2 : specifications ; specification no. 14 : phenolic cellulose paper copper - clad laminated sheet of defined flammability vertical burning test, economic quality ; amendment 5

    印製電路用基材.第2部分:規范.第14號規范:規定易燃性和經濟質量的酚醛纖維素紙銅覆層壓板
  9. Base materials for printed circuits. part 2 : specifications. specification no. 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality

    印製電路用基材.第2部分:規范.第2號規范:經濟型酚醛纖維素紙覆銅層壓板
  10. Base materials for printed circuits - part 2 : specification - specification n o 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality

    印製電路用基材.第2部分:規范.第2號規范:經濟型酚醛纖維素紙覆銅層壓板
  11. Base materials for printed circuits. part 2 : specifications. specification no. 1 : phenolic cellulose paper copper - clad laminated sheet, high electrical quality

    印製電路用基材.第2部分:規范.第1號規范:高電氣質量的酚醛纖維素紙覆銅層壓板
  12. Base materials for printed circuits ; part 2 : specifications ; specification 1 : phenolic cellulose paper copper - clad laminated sheet, high electrical quality ; amendment 2

    印製電路用基材.第2部分:規范.第1號規范:高電氣質量的酚醛纖維素紙覆銅層壓板.修改件2
  13. The results indicate that the sort of walling material is the most important factor in bond capacity of mortar, the mixed quantity of polymer and mortar strength follows, and there is a remarkable increase in mortar bond strength when the mixed quantity of pvb and mc is 20 % ~ 30 % and 0. 05 % ~ 0. 1 % respectively

    結果表明：塊體類別是最主要的影響因素，其次是聚合物摻量和砂漿強度；當聚乙烯醇縮丁醛和甲基纖維素的摻量分別為水泥質量的20 % ~ 30 %和0 . 05 % ~ 0 . 1 %時，可較大幅度提高砂漿的黏結強度。
  14. Base materials for printed circuits - part 2 : specifications - specification n o 1 : phenolic cellulose paper copper - clad laminated sheet high electrical quality

    印刷電路用基材.第2部分:規范. 1號規范.高電氣性能的銅包覆片層狀酚醛纖維素紙
  15. Materials for printed boards and other interconnecting structures - part 2 - 1 : reinforced base materials, clad and unclad - phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad

    印製板和其它互連結構用材料.第2 - 1部分:包被和非包被增強基材.酚醛纖維素紙增強銅包被經濟疊層板
  16. Materials for printed boards and other interconnecting structures - part 2 - 1 : reinforced base materials, clad and unclad - phenolic cellulose paper reinforced laminated sheets, economic grade, copper - clad

    印製板和其他互連結構用材料.第2 - 1部分:包被和非包被增強基材.酚醛纖維素紙增強銅包被經濟級疊層板
  17. Materials for printed boards and other interconnecting structures - reinforced base materials, clad and unclad - non - halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper - clad

    印製板和其他互連結構用材料.包被和非包被增強基材.銅包被的經濟級非鹵化酚醛纖維素紙增強層壓板
  18. Materials for printed boards and other interconnecting structures - part 2 - 23 : reinforced base materials, clad and unclad - non - halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad

    印製板和其他互連結構用材料.第2 - 23部分:包被和非包被增強基材.銅包被的經濟級非鹵化酚醛纖維素紙增強層壓板
  19. The product is a thermosetting molding compound, it is based on single stage phenolic resin as a matrix and mixed with organic fiber, mineral filler and other additives

    本產品是以酚醛樹脂為基材，加入纖維素和礦物填料及其它助劑所製成的熱固性模塑料。適宜於注塑成型，工藝性能良好。
  20. Materials for printed boards and other interconnecting structures - part 2 - 2 : reinforced base materials, clad and unclad - phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper - clad

    印製板和其它互連結構用材料.第2 - 2部分:包被和非包被增強基材.酚醛纖維素紙增強銅包被電工疊層板
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