annealing-in-process 中文意思是什麼

annealing-in-process 解釋
中間退火
  • annealing : 熱處理
  • in : adv 1 朝里,向內,在內。 A coat with a furry side in有皮裡子的外衣。 Come in please 請進來。 The ...
  • process : n 1 進行,經過;過程,歷程;作用。 2 處置,方法,步驟;加工處理,工藝程序,工序;製作法。3 【攝影...
  1. Among various fabrication techniques of thin film, the sol - gel process has gained much interest for the preparation of pzt thin film, due to ihe advantages of good homogeneity, easy control of composition, low in - ill i reaving temperature, easy formation of large area thin films pb ( zrxti : - k ) 0 :, ( pzt ) films were prepared on the ito coated glass plates and low resistor silicon wafer in sol - gel dip - coating process associated wi di heat treatment : at different temperatures and characterized by x - ray diffraction ( xrd ) and transmission electron microscopy ( tem ). lt is shown that the pzt ferroelectric thin films with ( 110 ) preferred orientation and well - crystallized perovskite structure can be obtained after annealing at 680 ? for 30 minutes on ito substrate and at 800 " c for lornin on silicon substrate

    Pzt的制備方法有很多,其中溶膠?凝膠( sol - gel )方法可以和集成電路( ic )光刻工藝相互兼容,處理溫度低,有大面積塗敷性能,能精確地控制組分,無需復雜的真空設備,成本低廉,所以對于集成鐵電薄膜電容的應用這種方法有很廣闊的前景。本文利用sol - gel技術在摻錫的in _ 2o _ 3透明導電薄膜( ito )襯底和低阻硅襯底上成功地制備了pzt鐵電薄膜。運用了x射線衍射, sawyer - tower電路和lcr電橋分別對薄膜的晶化溫度,結構和電學性能進行了測試。
  2. The dependence of oxygen precipitation and induced - defects in heavily as - doped silicon on heat treatment process was studied by annealing and ig process, chemical etching, scanning electron micrograph ( sem ) and transmission electron microscopy ( tem ). a developed ig technique was suggested and the mechanism of the influence of as on oxygen precipitation formation in heavily as - doped silicon was discussed

    本文通過化學腐蝕、光學顯微鏡、掃描電鏡( sem ) 、透射電境( tem )等分析技術,對重摻砷硅單晶在單步退火工藝和內吸雜退火工藝中氧沉澱及誘生缺陷的形態,形核與熱處理溫度、時間的關系等進行了研究。
  3. The soi is of crystal quality and the box is uniform in thickness, with the interfaces of si / sioa / si smooth and sharp. we have systematically studied the dependence of the formed soi structure on the process parameters, such as ion energy, implantation dosage, substrate temperature, as well as the annealing temperature. with xtem, sims, srp, rbs, ir, raman, aes, xps and other characterization tools, it was found that a dose window at fixed energy for water plasma ion implantation to form high quality soi structure similar to the conventional simox process exists

    本論文還系統地研究了不同注入劑量、注入能量、注入時基底溫度以及退火溫度對所形成soi結構性能的影響,藉助xtem 、 sims 、 srp 、 rbs 、 ie 、 raman 、 aes 、 xps等測試分析手段,我們發現,與傳統注氧隔離( simox )技術類似,存在著「劑量窗口」形成優質的soi材料,但在水等離子體離子注入方式中soi材料結構質量對劑量變化更為敏感,隨著注入劑量的增大, soi材料的埋層厚度增大而表層硅厚度減小。
  4. Sige simox : oxygen ions with high dose were implanted into sige grown directly on silicon substrate for the first time, and sige - oi novel structure was formed successfully with additional high temperature annealing ; it has been confirmed that oxygen implantation with 45kev, 3 1017cm - 2 and annealing at 12500c in ar + 5 % o2 for 5 hours, are fit for the formation of sige - oi structure ; ge loss during the high temperature annealing has been observed, which is originated from ge volatility and ge diffusion ; it has been proposed to use nanoporous layer induced by h + / he + implantation to surppress ge diffusion and to use surface oxidation to overcome the upper limit of sige simox. sige smart - cut : hydrogen ions were implanted into sige material and followed by high temperature process ( 4000c to 7000c ) ; blistering study was done and suggested the possibility of sige layer transfer by smart - cut technology ; it is concluded that the bubble formation is easier in sige than in si, and the strain in sige / si and the difference of binding energy in sige and in si could possibly contribute to this effect. behavior of sige / si implanted with hydrogen : gave a detailed study on sige implanted by beamline or phi hydrogen implantation ; it has been found that great strain is introduced into sige by hydrogen implantation and this strain could be alleviated by high temperature annealing ; both for conditional beamline implantation and piii hydrogen implantation, 600 is appropriate for the post - implantation treatment

    Sige - simox工藝方面:首次採用硅( 100 )襯底上直接外延的100nm厚sige的樣品中注入高劑量的o離子,通過退火處理成功制備了sige - oi新結構,即sige - simox工藝,證實了以45kev注入3 10 ~ ( 17 ) 7cm ~ ( - 2 )劑量的氧離子,隨后在氧化層的保護下經1250 , ar + 5 o _ 2氣氛的高溫退火( 5小時)過程,可以制備出sige - oi新型材料;實驗中觀察到退火過程中的ge損失現象,分析了其原因是ge揮發( ge通過表面氧化層以geo揮發性物質的形式進入退火氣氛)和ge擴散( ge穿過離子注入形成的氧化埋層而進入si襯底中) ,其中ge擴散是主要原因;根據實驗結果及實驗中出現的問題,對下一步工作提出兩個改進的方案:一是通過在si襯底中注入適量h ~ + / he ~ +形成納米孔層來阻斷ge擴散通路,二是可以通過控製表面氧化來調節安止額士淤丈撈要表面sige層中的ge組分,從而部分解決sige
  5. Computer simulation of grain growth in two dimensions in annealing process

    退火過程中晶粒生長的二維計算機模擬
  6. In this dissertation, high quality ( 002 ) textured zno films were prepared on silicon substrate using electron beam evaporation method. in addition, zno nano - particle material embedded into mgo thin films was prepared by a co - evaporation ( thermal and electron beam evaporation, simultaneously ) method and a following post - annealing process in oxygen ambient

    本文介紹了採用電子束蒸發方法在si襯底表面上制備出了具有c軸擇優取向的高質量氧化鋅薄膜材料,另外,還採用共蒸發(通過電子束蒸發與熱蒸發同時進行)及後退火的簡單方法制備出包埋到介電物質mgo薄膜中的zno量子點材料。
  7. In this dissertation, nanometer zno thin films on si ( 100 ) substrates were prepared by using thermal evaporation technique following by two - step annealing process : high quality zno thin films and mgxzn1 - xo alloy films have been grown on si ( 100 ) substrates with mgo buffer layers by using thermal evaporation technique following by two - step annealing process

    本文介紹了採用電子束蒸發方法在si補底上制備出了高純度的金屬鋅膜,然後通過二次退火得到了具有六角結構的高質量氧化鋅多晶薄膜材料,另外,還採用電子束蒸發mgo薄膜作為緩沖層二次退火金屬鋅膜的方法制備出了高質量氧化鋅多晶薄膜材料和mgzno合金薄膜材料。
  8. The first one was called one step process or isothermal deposition and annealing process. in this process, the ceo _ 2 layers were formed at high temperature and oxidative atmosphere and then annealed at the same temperature. the relationship between the growth parameters and the textured degree of ceo _ 2 thin film was systematically studied, and the optimal growth parameters were summaried

    採用等溫退火法(或稱「一步法」 )沉積ceo _ 2 ,即:先在氧化性氣氛下直接反應生長ceo _ 2薄膜,再在與沉積溫度相同的溫度下對薄膜進行退火處理,系統研究了沉積溫度、退火時間、水蒸汽分壓對薄膜c軸織構程度的影響。
  9. The accidental quenching, occurring in the sintering process, will make the steel back of a powder alloy brake lining brittle and useless. in this paper, an annealing process has been adopted to regain the plastic property of the steel back while the other properties of cg03 brake linings are still remained

    粉末合金剎車片在燒結後有時會意外淬火,造成剎車片鋼背脆化而報廢.採用一種退火工藝,在保持剎車片其它性能的同時,使剎車片鋼背恢復塑性
  10. A simple and economical oil removal process is introduced. in oil removal equipment, the profiled hinge is prinkled high - efficiency detergent and cleaned mechanically. surface quality of finished profiled hinge is improved with no black carbide films attached after annealing

    介紹了簡便、經濟的除油脫脂方法? ?在機械除油裝置中噴淋高效清洗劑,用機械擦試的方法清洗鉸鏈異型材,使成品退火后的異型材無碳化黑膜附著,從而提高其表面質量。
  11. Abstract : a simple and economical oil removal process is introduced. in oil removal equipment, the profiled hinge is prinkled high - efficiency detergent and cleaned mechanically. surface quality of finished profiled hinge is improved with no black carbide films attached after annealing

    文摘:介紹了簡便、經濟的除油脫脂方法? ?在機械除油裝置中噴淋高效清洗劑,用機械擦試的方法清洗鉸鏈異型材,使成品退火后的異型材無碳化黑膜附著,從而提高其表面質量。
  12. As annealing temperature is 400, the phase of fexsy is greigite ( fe3s4 ) the fexsy particles cover the porous film of tio2. the average size of fexsy particles range from 5000nm to 20nm as the concentration of the starting solution decreasing. after five times of coating - annealing process, fexsy particles form aggregate in size of 10 m

    鐵硫化合物顆粒覆蓋在多孔tio _ 2基底上,顆粒尺寸隨著初始溶液濃度減小從幾個微米減小到十幾個納米,隨著塗膜厚度、退火時間增加,鐵硫化合物的形貌按顆粒狀島狀層狀變化。
  13. The effect of high temperature in rapid thermal process ( rtp ) on the dissolution of oxygen precipitate generated by two - step ( low - high ) annealing is investigated

    摘要通過對已經過兩步(低高)退火的大直徑直拉矽單晶片進行高溫快速熱處理,研究矽中氧沈澱被高溫快速熱處理消融的情況。
  14. In this work, the influences of fabrication process on microstructure, dielectric properties, ferroelectric properties and pyroelectric properties of plt films have been studied. plt films were prepared on the pt ( 111 ) / ti / sio2 / si ( 100 ) substrates by radio frequency magnetron sputtering method and then annealed by rapid thermal annealing process ( rta ) or conventional furnace annealing process ( cfa ). with the help of atom force microscopy ( afm ), x - ray diffraction ( xrd ) and some other apparatus, it was found that : lower substrate temperature ( ts ) was helpful for plt films to form better surface morphologies. with the increase of substrate temperature, the dielectric constant of plt films increased

    Afm 、 xrd以及性能測試結果表明:較低的基片溫度有利於形成表面均勻緻密的薄膜,且薄膜的表面粗糙度均方根較小;隨著基片溫度的升高,經過快速退火的plt薄膜的介電常數逐漸增大;相比于傳統退火,快速退火縮短了退火時間,提高了薄膜的介電和鐵電性能;快速退火隨著保溫時間的延長,大部分鈣鈦礦結構的特徵峰的峰強增大,半高寬減小,峰形越來越尖銳,但當保溫時間為80s的時候, ( 100 )和( 110 )峰的強度有所下降,因此保溫時間在60s較為適宜。
  15. Additional annealing experiments in nitrogen atmosphere revealed that the heavily damaged region with hydrogen - induced defects appears to be the adsorption center for the outside oxygen to diffuse into the silicon during the high - temperature annealing process, and consequently, broaden the thickness of the box layer. this important finding may provide a possible solution to reduce the cost of the conventional simox - soi wafers while maintaining a desirable box thickness

    獨特設計的氮氣氛退火及分步退火實驗證明了原注入樣品的缺陷層中氫及氫致缺陷的存在使得在退火過程中加速外界氣氛中的氧擴散進來,並成為強捕獲中心使擴散進來的氧滯留于缺陷層從而促使氧缺陷層中的氧沉澱生長,加速了高溫退火中的內部熱氧化過程,從而形成了比傳統相同劑量simoxsoi厚得多的氧化埋層。
  16. Phase transition takes place in the annealing process

    退火會使晶相結構發生變化。
  17. The calculation determined the main point defect under different cd pressure and the reaction enthalpies and entropies and the equilibrium constants in ( cd, zn ) te according to the quasi - chemical equations written for cdte sublattice. also the recipe of two - zone annealing process for cd0

    根據計算結果,確定了不同氣氛條件下cd _ ( 1 - x ) zn _ xte ( x = 0 . 05 )晶體中佔主要地位的點缺陷和相關偽化學反應式的反應焓、反應熵及平衡常數,給出了兩溫區本徵退火的具體參數。
  18. Fuzzy c - means algorithm is used to cluster the production data in batch annealing process, then the exponent least square algorithm is used to get the relationship between cooling time and weight of clusters

    採用模糊c均值聚類方法對退火生產數據進行處理,再基於得到的聚類數據點進行指數最小二乘回歸。
  19. In the making process we use hot - forging warm - forging cold extrusion forming and magnetic annealing processes to completely solve the problem of complex form hign precision dimensions difficult manufacturing lower power and so on. what s more, part surface is very smooth with no trimmed margin, continuous flowing metal fiber, high strength, lower noise. forged claw poles obviously increase generator s power and life, and also improve finished product rate of roughness

    在製造過程中採用了熱鍛溫鍛冷擠壓成型及磁性退火等先進生產工藝徹底解決了精鍛「爪極」形狀復雜尺寸精度高製造難度大功率低等問題,且產品表面光潔無飛邊金屬流動纖維連續毛坯強度大噪音低,明顯提高了發電機的功率和壽命,並且提高了毛坯成品率。
  20. Superconducting mgb2 thin films were fabricated on single - crystal sapphire substrate by hfcvd and hpcvd, respectively. the experiments were carried out both in situ and ex situ. in situ method refers to acquiring mgb2 thin films directly during the deposition process. ex situ method is defined as obtaining mgb2 thin films indirectly by post - annealing of precursor b film in high mg vapor pressure at high temperatures

    實驗分原位法和非原位法兩種工藝,原位法是在薄膜沉積過程中直接生成了mgb2超導薄膜;非原位法是先在基片上沉積前驅物b膜,然後將b膜在mg蒸氣中高溫退火得到mgb2超導薄膜。
分享友人