intermetallic compounds 中文意思是什麼
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The study of structure and micro - mechanism of the sm3 fe1 - xvx 29 intermetallic compounds
29的結構及基微觀機制研究 -
Evolution of intermetallic compounds in snag and snagcu lead - free solder joints during aging
無鉛焊料接頭中金屬間化合物在時效中的演變 -
Method of tensile test for intermetallic compounds - part 1 : room temperature tensile test
金屬間化合物抗拉伸試驗方法.第1部分:室溫抗拉伸試驗 -
Method of tensile test for intermetallic compounds - part 2 : elevated temperature tensile test
金屬間化合物抗拉伸試驗方法.第2部分:高溫抗拉伸試驗 -
Study on structural stability of mg - ce intermetallic compounds based on the pseudopotential plane - wave method
化合物相結構穩定性的贗勢平面波方法研究 -
The process and mechanism of ball bonding were studied in this paper, specifically, intermetallic compounds ( imc ) formation and reliability on copper wire and aluminum alloy pad bonding joint during thermal aging were analyzed in detail
本文在對銅絲球鍵合工藝和原理研究的基礎上，著重分析了老化過程中銅絲球與鋁合金焊盤鍵合的金屬間化合物生長及可靠性。 -
Tial - matrix intermetallic compounds have become one of the hottest high - temperature structural materials recently, due to its excellent high - temperature properties and lower density
Tial基金屬間化合物因具有優良的高溫性能和較低的密度，從而成為目前世界上研究最為熱門的高溫結構材料之一。 -
The simplest way of making intermetallic compounds ? by just melting the elements together ? was not possible in this case, because the two elements have very different melting points : 650 degrees c for magnesium and higher than 2, 000 degrees c for boron
製造金屬互化物最簡單的方法，就是將組成元素一起熔化，但是這種方法在這里卻不適用，因為這兩種元素的熔點相差太多：鎂的熔點是650 ，而硼的熔點則超過2000 。 -
However, the die attach layer delaminated after 500 cycles and pcb cracked in the underfilled samples after long time cycling. c - sam is employed to investigate the delamination in the underfilled samples. highly concentrated stress - strain induced by the cte mismatch between the bga component and the pcb board, coarsened grain and two kinds of intermetallic compounds ( nisn / nisns ) which formed during reflow and thermal cycle and their impact on the reliability of solder joints are discussed in this paper
充膠樣品粗化尤為嚴重； ? ni - sn金屬間化合物包括兩層：其中，靠近ni焊盤的那層比較平整，同時， eds結果分析表明其化學式近似為nisn ，而靠近焊料的那層呈板條狀，化學式近似為nisn _ 3 ，文獻表明其為亞穩相； ?充膠使得樣品最大應力范圍降了接近一個數量級並降低了dnp的作用，同時，器件失效模式變為晶元粘接層分層； ? c - sam結果表明本論文採用的充膠樣品，晶元粘接層分層起始於500周左右，而經過2700周循環的樣品，分層幾乎擴展到整個界面。 -
Being a new generation of high temperature structure materials, ni / al and ti / al system intermetallic compounds are most potentially. they possess many excellent capabilities at high temperature such as high strength, corrosion resistance, contrast intensity and contrast rigidity
Ni al系和ti al系金屬間化合物是極有潛力的新一代高溫結構材料，它們具有許多優良性能，如高溫高強度、高溫耐蝕性、高的比強度和比剛度等。 -
It was found that the interfacial bonding of 93w - ofc was both the joining action of ofc / w grains and that of ofc / ni - fe binders, whereas the joining of ofc to tc4 could be seen as the mutual intense diffusion effect between ofc / tc4 and as a result cu - ti intermetallic compounds were formed at the joint. the joining of tc4 - a1 and a1 - mb2 were also attributed to the result of diffusion between elements ti - al and al - mg respectively. on the other hand, residual thermal stress and stress - induced distortion were produced at the joint simultaneously due to the difference in thermal expansion coefficient of different welding " materials
研究表明， 93w與ofc的界面連接是ofc與93w中w晶粒的連接以及ofc與93w中ni - fe粘接劑的連接共同作用的結果； ofc與tc _ 4連接界面的形成是由於ofc與tc _ 4之間發生反應擴散，並由此在二者接頭處生成了cu - ti金屬間化合物的中間相； tc _ 4 - al的連接與al - mb _ 2的連接則分別是其基體元素ti 、 al之間和al 、 mg之間元素互擴散的結果，另外，由於熱膨脹系數的差異，擴散焊接后在不同焊件的接頭處存在殘余熱應力並由此引起接頭的形變。
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