surface of package 中文意思是什麼

surface of package 解釋
包裝表面
  • surface : n 1 表面；地面；水面；廣場，空地。2 外觀，外表，皮毛。3 【幾】面；切口；【航空】翼面。adj 表面的...
  • of : OF ＝Old French 古法語。
  • package : n 1 包裝，包紮。2 〈主美〉包，包裹，捆，束，組；（產品等的）（一）件，件頭。3 包裝用物；（包裝用...
  1. The measurement, gross weight, net weight of each package, port of destination and any necessary cautions such as “ do not stack upside down ”, “ keep away from moisture ”, “ handle with care ”, “ hookon point ” shall be stenciled on the surface of each package with fadeless pigment, whenever necessary

    1每件包裝貨物的尺寸、毛重、凈重、目的口岸以及任何必要的注意事項，例如： 「不要倒置」 、 「防潮」 、 「小心輕放」 、 「起吊點」等，在有必要時應以不褪色的顏料印刷在每件包裝物的表面。
  2. The contract no., measurement, gross weight, net weight of each package, the heat number, port of destination and any necessary cautions such as “ do not stack upside down ”, “ keep away from moisture ”, “ handle with care ”, “ hook - on point ” shall be stenciled on the surface of each package with fadeless pigment, whenever necessary

    1每件包裝貨物的合同編號、尺寸、毛重、凈重、爐號、目的口岸以及任何必要的注意事項，例如： 「不要倒置」 、 「防潮」 、 「小心輕放」 、 「起吊點」等，在有必要時應以不褪色的顏料印刷在每件包裝物的表面。
  3. Series of guowei dry - method composite machines as new product are explored with our many years ' experience, the requirement of the users. the first metal of this machine is adopted with : photo - ecectricity auto. tracking " correcting deviation equipment, magnetic powder tension control. pneumatic back pressure shifting blade, oven temperature controlled qutomatically, big roll with oil heating, coating composite pneumatic control as well as double frequency governor etc. it will make the machine with fast speed, lower voice, low polluted by air, shout consumptionfor energy, stable working etc. especially suitable for al - foil with smooth surface and no enough firming, glass paper, polyester ect. the composite material with hard strength, fireproof, anti - ventilation, anti - fatty, frozen, dudrable steam etc character. it is widely used in food, pharmacy, as well as daily articles to package

    「國偉」 、系列乾式復合機，是我廠根據多年的復合機製造經驗及結合客戶需求，開發的新產品，該機第一基材採用了「光電自動跟蹤」糾偏放卷裝置，磁粉張力控制、氣動背壓移動式刮刀、烘箱溫度分段自動控制、大輥筒導熱油加熱、上膠復合氣動控制及雙變頻調速技術，使該機具有復合速度快、噪聲低、空氣污染小、能耗低、運行平穩等特點，適宜於表面光滑的鋁箔玻璃紙聚酰胺等與聚乙烯、聚丙烯等薄膜的復合，復合薄膜具有強度高、防水、防透氣、防油脂、可冷凍、蒸煮等優點，廣泛應用冷凍食品、乾燥食品、醫藥品及日用品的包裝。
  4. High - qualified designers and engineers of chaowei are able to provide various high - qualified design services such as ic software program, circuit board, product appearance, products structure, and product package, etc. the factories directly under chaowei have advanced production abilities including mould making, inection moulding, surface spray - painting, silk - screening, shift - screening, smt, welding and assembling, quartz clock core production, and quality check and assurance. chaowei held many design patents and utility model patents, at the same time, national clock and watch quality certification, national technical supervision bureau certification, usa fcc and astm security authentication, canada ic, and euro ce are achieved, the rich experience in oem and odm can ensure high quality products and professional service

    超維公司擁有一批高素質的專業設計師和工程師，有能力為國內外客戶提供包括ic軟體編程線路板設計產品外觀設計產品結構設計產品包裝設計等多方面高水準的設計服務超維的直屬工廠則擁有模具製造注塑成型表面噴漆絲印移印smt焊接裝配石英鐘機芯製造品質檢驗測試等先進的生產能力超維公司的產品擁有大量的外觀設計專利和實用新型專利，同時獲得了國家鐘表質量檢驗中心的合格證書國家技術監督局檢驗合格證書美國fcc認證和astm安全認證加拿大ic認證歐盟ce認證。
  5. Package technology and trends of surface acoustic wave devices

    聲表面波器件的封裝技術及其發展
  6. When you run a package, ssis designer depicts progress on the design surface of the

    在運行包時， ssis設計器用指示狀態的顏色顯示每個數據流組件，以此在
  7. The clean operation area and standard clean operation area should be installed the air regulating equipment ; when regulate air, enter or exhaust air or use electric fan, the air must be flowed from high clean area to low clean area to prevent the touch surface of food and interior package materials were polluted

    清潔及準清潔作業區應裝設空氣調節設備；廠房內之空氣調節、進排氣或使用風扇時，其空氣流向應控制由高清潔區流向低清潔區，以防止食品接觸面及內包裝材料可能遭受之污染。
  8. Aiming at the medium thickness slab caster in anshan isco, numerical simulations concerning fluid flow and free surface wave process of liquid steel in mold were conducted by using the cfx4. 4, a commercial software package for fluid flow analysis, in which the metallurgical functions of a submerged nozzle, specially the submerged nozzle with three holes, were investigated emphatically

    摘要以鞍鋼中薄板坯連鑄機為對象，在商業軟體cfx4 . 4的平臺上對結晶器內鋼水流動和液面波動過程進行了數值模擬，重點研究了其所獨有的3孔浸入式水口的冶金功能。
  9. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of quad flat packs

    半導體裝置的機械標準化.表面固定半導體裝置包裝外廓線繪制一般規則.包裝尺寸測量方法
  10. Mechanical standardization of semiconductor devices - part 6 - 3 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; measuring methods for package dimensions of quad flat packs

    半導體器件的機械標準化.第6 - 3部分:表面安裝半導體器件封裝外形圖繪制的一般規則.四面扁平部件封裝尺寸的測量方法
  11. Mechnical standardization of semiconductor devices - part 6 - 3 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of quad flat packs

    半導體器件的機械標準化.第6 - 3部分:半導體器件包裝用表面安裝略圖制備的一般規則.四方塊包裝件包裝尺寸的測量方法
  12. If you are using a packing slip, place it on the same surface of the package as the address label

    如果您使用包裝紙條，請放于包裹上，地址標簽的同一面。
  13. The dts designer displayed menus, a toolbox of connections and tasks, and a single package design surface

    Dts設計器顯示了菜單、連接和任務的工具箱以及單個包設計圖面。
  14. To help answer these questions, the probe carries a surface science package ( ssp ), which will emit sound waves in the final stage of the descent to gauge the roughness of the surface

    為回答這些問題，探測器載有一套表面科學儀器組（ ssp ） ，將在降落的最終階段發出聲波，以測定表面的粗糙度。
  15. This series products adopted the surface package modularization craft, have improved greatly the anti - interference ability of the instruments, have display, transmit communication, universal signal input function and so on. they apply to indication and control of various physical quantity check signal such as temperature, humidity, pressure liguid level, instantaneous flow, velocity etc., and for various nonlinear input signal can carry out high accuracy linear compensation

    本系列產品採用表面封裝模塊化工藝，大大提高了儀表的抗干擾能力，具有顯示控制變送通訊萬能信號輸入等功能，適用於溫度濕度壓力液位瞬時流量速度等多種物理量檢測信號的顯示及控制，並能對各種非線性輸入信號進行高精度的線性校正。
  16. Control flow tab, for building the package functionality that consists of the discrete tasks the package performs, the precedence constraints that link one task to the next, and the looping structures that define repeating workflow in the package. the data flow design surface on the

    選項卡上的控制流設計圖面，用於生成由包執行的離散任務，將一項任務鏈接到下一項任務的優先約束，以及定義包中重復工作流的循環結構組成的包功能。
  17. Besides, it is capable of making different surface treatment on tools according to client s requirements, such as teflon, paint spraying, plastics spraying, blackening, ti - plated, and phosphate treatment, etc. for the package, there are various kinds of styles, like medium and high - grade wooden box, plastic step box, hollow plastic suction box, and double - bubble shell color card, etc

    建廠11年來，在各級政府的正確指導下，以及社會各界的大力支持下，從作坊式生產形式發展到目前具有一定規模的木工刃具的專業生產企業。特別是近兩年，外貿生產發展迅速，企業銷售產值逐年上升，今年生產形勢繼續看好。
  18. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of ball grid array

    半導體器件的機械標準化.繪製表面安裝半導體器件封裝外形圖的一般規則.焊球網格陣列封裝尺寸的測量方法
  19. Bga mechanical standardization of semiconductor devices - part 6 - 4 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of ball grid array

    半導體裝置的機械標準化.第6 - 4部分:表面安裝半導體裝置封裝外形圖繪制的一般規則.球狀網格陣列
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