wafer probing 中文意思是什麼
wafer probing
解釋
晶圓測試-
The wafer probing scheduling problem ( wpsp ) is a variation of the parallel - machine problem, which carries with the objective to minimize the total workload to enhance the utilization rate of machine capacity
摘要晶圓針測排程問題為平行機臺排程問題的一種，且排程的目標在最小化所有機臺的工作負荷以提高機臺利用率。 -
However, to minimize the maximum completion time for the wafer probing scheduling problem ( wpsp ) is very important for equally utilizing the capacity of parallel - machine, while satisfying the requirements of product types, product family, sequence dependent setup time, product - type dependent processing time, due dates of jobs, and capacities of machines
然而求解晶圓針測排程問題最大完工時間的最小化以均勻的利用平行機臺的產能是非常重要的，該問題尚考慮以下的問題特性：產品別與產品族、順序相依設置時間、決定於產品別的工作處理時間、工作交期與機臺產能限制等。 -
More than ic manufacturing, smic provides customers with a seamless flow of support with services that include design support, mask making, and wafer probing
除提供晶元生產，中芯國際還為客戶提供全方位的一站式服務，包括輔助設計、光掩膜版製造以及硅圓片上測試。 -
They started in the very early days of the semiconductor industry and have consistently made highly reliable equipment with unique technology for wafer probing
早在半導體行業發展初期，伊智就開始著手從事該行業，並始終堅持用獨特的技術製造高可靠性的晶圓探針臺。 -
Because of this, nearly every major semiconductor manufacturer in the world relies on electroglas ‘ wafer probing technologies to help them maximize the overall efficiency of their wafer and device testing processes
正因為如此，幾乎全世界所有的半導體主要生產商都依靠伊智公司的晶圓探針技術來幫助他們全面提升晶圓和器件測試過程的效率。
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