wafer processing 中文意思是什麼
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Excimer laser processing equipment for wafer stepper
準分子激光縮小投影曝光設備用 -
Upon its establishment tera xtal managed to recruit the top technical personnel in crystal growth and wafer processing fields. their first mission was to manufacture the lithium tantalate crystal substrate for the rf saw filters used in the wireless applications
凝聚國內長晶及晶圓加工等技術第一流菁英共同組成的經營團隊投入創業，半年來最主要的課題就是在最短的時間內生產出無線通訊器材內射頻表面聲波濾波器 -
Chemical - mechanical - polishing ( cmp ) has been rapidly developing and finding extensive applications in the integrated circuit ( ic ) manufacturing industry for processing hard disk of computer and silicon wafer with super - smooth and flawless surface
集成電路（ ic ）製造工業中，化學機械拋光（ chemicalmechanicalpolishing ， cmp ）廣泛應用於計算機硬盤片、硅晶片超光滑無損傷表面的加工。 -
As czt wafer is so gentle and crisp that the surface processing is a hard task
Czt晶片軟且脆，表面加工難度很大，很容易破碎。 -
Scheduling rule for batch processing machines of semiconductor wafer fabrication facilities
半導體生產線批加工設備調度規則 -
However, to minimize the maximum completion time for the wafer probing scheduling problem ( wpsp ) is very important for equally utilizing the capacity of parallel - machine, while satisfying the requirements of product types, product family, sequence dependent setup time, product - type dependent processing time, due dates of jobs, and capacities of machines
然而求解晶圓針測排程問題最大完工時間的最小化以均勻的利用平行機臺的產能是非常重要的，該問題尚考慮以下的問題特性：產品別與產品族、順序相依設置時間、決定於產品別的工作處理時間、工作交期與機臺產能限制等。 -
The principle advantages of vcsels over conventional edge - emitting lasers lie in ultralow threshold current, small far - field divergent angle, high modulation frequency, potential for wafer level testing and the ease for single longitudinal mode operation and two - dimension integration. as a result they show considerable promise for applications such as optical fiber communication, parallel optical interconnects, optical information processing and neural networks, etc. a direct coupling theoretical model in quasi - three - dimension for the gain - wave guide vertical - cavity surface - emitting lasers has been created in this paper
它與傳統的邊發射激光器相比具有更優越的特性，例如，具有極低的閾值、較小的遠場發散角、調制頻率高、易實現單縱模工作和二維集成，無須解理封裝即可進行在片測試等，所以，它被廣泛應用於光纖通訊、并行光互聯、光信息處理、光神經網路等領域。 -
A common distribution core that providesall electrical power, gases, chemicals, and other services to the sectors of an automated wafer processing system
一種公共分配中心，向自動化晶片處理系統中的各個部分提供所有的電源、氣體、化學原料和其它服務。 -
The wafer processing system is an important subsystem of the lithography, which consists of a wafer transmission system and a wafer pre - alignment system
晶圓處理系統是光刻機的重要組成子系統，其包含兩個主要部分:晶圓傳輸系統和晶圓預對準系統。 -
At present, the problem in testing sheet resistance for micro - areas is that probes must be set up at the suitable locations by handwork. in order to know the wafer ' s impurity distributing, we need test many times, so will waste a lot of time. if the wafer ' s diameter would be 300mm, this problem will be more serious. in this paper, image analysis is introduced, through pre - processing and edge picking - up, the probe tips are recognized. then probe tips will be aligned respectively in two perpendicular directions through driving stepper motors. thus the distribution of sheet resistance for whole wafer is got by automatic testing and it offers information for detecting the impurity distribution and the diffusion uniformity
這樣，完成200mm （ 8時）圓片雜質的擴散分佈需要對許多圖形進行測試，需要花費很長的時間，當測試300mm矽片時問題就更為突出。本文將圖象與視覺測量系統引入四探針測試系統中，對採集到的原始探針圖像進行預處理、邊緣提取等操作，以便實現探針針尖的識別，然後由電機控制實現探針的自動定位。這樣測試系統可以自動獲得全片的薄層電阻分佈，為超大規模集成電路檢測雜質分佈和擴散的均勻性提供信息。 -
Wafer processing equipment
薄片加工裝置
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