晶圓凸 的英文怎麼說
中文拼音 [jīngyuántū]
晶圓凸
英文
flex on ca wafer bumping-
Screen printing technology for solder ball flip chip for smt
倒裝晶元及晶圓和基底凸起的網版印刷技術一Back then, chip designers considered it risky to add two or three layers of metal on top of the silicon wafer because each new layer added hills and valleys that made it difficult to keep photolithographic patterns in focus
當時的晶片設計者認為在矽晶圓上加上兩三層金屬有點冒險，會使晶圓表面凹凸不平，增加光刻過程中聚焦的困難。While expensive eda tools are required for ic design, other types of equipment are also needed for other parts of the cycle, such as wafer fabrication, packaging, wafer bumping, testing, etc. currently, most hong kong ic design companies have to rely on overseas companies to perform these tasks
集成電路設計工作須要利用昂貴的電子設計自動化工具，但周期內其他環節如晶圓加工、封裝、晶圓凸塊製造、測試等，卻需要其他類型的儀器。目前香港大部分集成電路設計公司均要依賴海外公司進行有關工作。
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