焊接封裝 的英文怎麼說

中文拼音 [hànjiēfēngzhuāng]
焊接封裝 英文
welded encapsulation
  • 焊 : 動詞（用熔化的金屬修補金屬器物或使金屬工件連接起來） weld; solder
  • 接 : Ⅰ動詞1 （靠近;接觸） come into contact with; come close to 2 （連接; 使連接） connect; join; put ...
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 焊接 : weld; welding; soldering; seal; sealing; sealing-in; shutting together
  • 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
  1. ( 2 ) design of the implantating device : some quantity of 316l stainless steel, perform forging and thermal rolling, drawing filament ( diameter 0. 4mm and 0. 23mm respectively ), enlacing and jointing, after that assembling the products into guiding filum, a technical examination was carried out to appraise their physical capability. the second part : experimental study : animal experiments were used to screen and observe its validity and security : under general anesthesia, tracheotomy was performed on the healthy dog, the bronchus was localized using x - ray fluoroscopy fibrobronchoscope and with the help of the implanting equipment, several niti alloy occludes were implanted into the target bronchus of the dogs through the biopsy channel in the fibrobronchoscope

    （ 2 ）推送器的研製：取316l不銹鋼熱軋，分別拉製成不同直徑的不銹鋼絲分別用作製作內芯、外環及車制螺絲，再經纏繞、焊接、裝配成推送器。對上述兩者進行技術鑒定。第二部分：支氣管封堵器的實驗研究：四種形狀的封堵器分四組（上述四種封堵器各12隻）進行動物實驗，分別觀察其安全性與有效性。
  2. Y detail specification for fixed connector electric, jam nut mounting, solder type, hermetic seal, bayonet coupling, series, classes y for jy27477

    系列. jy27477卡口連接錫焊式接觸件氣密封壓緊螺母安裝固定電連接器
  3. During the course of the manufacture for packaging 2000 pixel hgcdte irfpa wafer, some crucial techniques are solved, such as the design of the button stem structures with inclined dragging wires applied in cryogenic platform, the optimization of long linear irfpa detector ' s signal wires layouts, the implement of a fanout board having thin film gold metalization for defining the required electrical conductors and a method of hermetically sealed vacuum enclosure of large dimension windows, etc

    在用於封裝2000元碲鎘汞焦平面晶元的分置式微型杜瓦研製中，詳細闡明了一種焦平面晶元其裝載面為斜拉式支撐結構的設計，實現了探測器外引功能線的布線優化及其輸出引線工藝改進，並提出了一種大尺寸高氣密光學窗口的焊接方法等關鍵技術。
  4. Closure flanges may be mechanically seamed or welded in place. gaskets or other sealing elements shall be used with closures, unless the closure is inherently leak proof

    封閉裝置凸緣可用機械方法或焊接方法洽當接合。除非封閉裝置本身是防漏的，否則必須使用墊圈或其他密封件。
  5. Since solder balls do oxidize quickly and builds an oxide coat that reduces the soldering characteristic of the ball, the chips should be vacuum sealed shortly after the reball process

    因為很容易氧化並且形成一個氧化層覆蓋會降低錫球的焊接特性，所以在重新植球加工后應盡快真空封裝。
  6. The design reuse technology based on feature has been researched. the domain feature and management feature in welding fixture design have been represented. more over, the tools for the features reuse have been realized

    （ 4 ）研究了基於特徵的設計重用技術，應用該技術封裝了焊接夾具設計中的幾何特徵和管理特徵，開發了航空焊接夾具特徵重用工具。
  7. After the installation of the transformer, the sealing points will be guaranteed without leakage and the correct readings of every instruments until the handover is up to the grade

    6變壓器安裝完畢后，保證各密封點焊縫無滲漏，各表計準確無誤，各項交接試驗合格。
  8. Magnetic head is designed by six magnetic poles in symmetrical distribution, the design of excitation loop and excitation angle makes magnetic field act on welding arc region which could control welding arc effectively. the insulation, cooling and hermetization of magnetic head avoid the influence on magnetic field of outside ; miniaturization design of magnetic head could achieve different welding process

    磁頭裝置採用六磁極對稱勵磁方式設計，勵磁線圈和勵磁角度的設計使產生的磁場恰好作用於焊接電弧區域以實現對電弧的有效控制;磁頭的絕緣，冷卻，密封設計避免了焊接過程中外界因素對磁場的干擾;磁頭整體的小型化使該裝置可以實現多種形式的焊接工藝。
  9. The nd : yag laser welding technology is being widely used in to - can style package for laser diode

    論文中運用nd : yag激光對同軸激光二極體組件進行焊接封裝。
  10. Die bonder is a kind of microelectronics encapsulation device that welds transistors to the base. temperature control system is one important part of it

    粘片機是一種將晶源焊接到底座的微電子封裝設備，溫度控制系統是其較為重要的組成部分。
  11. Thermal and welding residual stress often produces in the proceeding of the electronic package, the residual stress release and thermal deformations of the microelectronics will reduce the assemble intensity between the chip and package, and then debase the electrical performance of the assemble circuit, numerous thermal cycling will lead to thermal fatigue or thermal failure of the microelectronics

    電子封裝器件在生產的工藝過程中，往往會產生熱殘余應力以及焊接殘余應力，殘余應力的釋放作用及器件在使用過程中的熱變形，會降低集成電路晶元與封裝體的結合強度，進而降低集成電路的電性能，反復的熱循環，將導致器件的熱疲勞失效，嚴重時可導致矽片或陶瓷片破裂，使整個器件遭到破壞。
  12. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages

    完成某集成電路封裝（叩焊晶元）內部實際的電氣連接的焊料中的鉛。
  13. Third, it analyzes different influences upon the life predication by comparing different models of the same package, different constitutive models of the same solder ball ' s materials, different life prediction models, different solder ball dimensions, different mesh density etc. finally, it compares some popular constitutive models of the solder ball materials, and constructs an integrated constitutive model by different curve fits

    接著，又在上述分析的基礎上，比較了同種封裝的不同模型（如條形模型， 1 4模型， 1 8模型） 、相同焊球材料的不同本構模型、不同壽命預測模型、不同焊球尺寸及網格密度等方面對壽命預測的影響。
  14. 2. the design process reuse for aeronautic welding fixture design has been researched. a welding fixture design process model has been build by the directed graph technology, based on which the design process wizard encapsulating the parameter and assembly relation between design actions has been developed

    （ 2 ）研究了航空焊接夾具設計流程重用技術，建立了航空焊接夾具設計流程有向圖模型，開發了航空焊接夾具設計流程向導，並利用該向導封裝了設計活動間的參數傳遞關系和裝配關系。
  15. The entire seat - hinge - pin - disc assembly can be tested outside the valve before placing into the body and seal welding. eliminates pin seal leakage

    在安裝到閥體內部和進行密封焊接之前，全部的閥座-鉸鏈-銷釘-閥瓣總裝可以在閥門外部進行測試。避免銷釘密封泄漏。
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