熱致破裂 的英文怎麼說

中文拼音 [zhìliè]
熱致破裂 英文
thermal fracture
  • : Ⅰ動詞1 (給與;向對方表示禮節、情意等) deliver; send; extend 2 (集中於某個方面) devote (one s ...
  • : Ⅰ動詞1 (完整的東西受到損傷) be broken; be damaged 2 (使損壞) break; break down; damage 3 (使...
  • : 裂動詞[方言] (東西的兩部分向兩旁分開) open
  • 破裂 : break; fracture; burst; split; rupture; crack
  1. Upon cooling, the thermal mismatch between residual silicon and quartz usually results in the fracture of the crucible.

    當冷卻時,殘余的硅和石英間的失配往往導坩堝
  2. Marine insurance policy of certificate in duplicate, indorsed in blank, for full invoice value plus 10 percent stating claim payable in thailand covering fpa as per ocean marine cargo clause of the people ' s insurance company of china dated 1 / 11981, including t. p. n. d. loss and / or damage caused by heat, ship ' s sweat and odoour, hoop - rust, breakage of packing

    保險單或保險憑證一式二份,空白背書,按發票金額加10 %投保,聲明在泰國賠付,根據中國人民保險公司1981年1月1日的海洋運輸貨物保險條款投保平安險,包括偷竊提貨不著,受船艙發汗,串味,鐵箍銹損,包裝所導的損失。
  3. Analyzed the reason of stress corrosion cracking on u shape brass tube bundle when it is having penetrative test with ammonia, improved technology of test and gave out the method should be paid attention to during the process of brass tube exchanger

    摘要對黃銅管換器管束在氨滲試驗過程中發生應力腐蝕,導銅管的原因進行了分析,改進了施工方案,並提出了黃銅管換器製造過程中對管束進行耐壓試驗時的注意事項。
  4. In poor packages, too large stresses are formed, which often results in cracking of chips and delaminating at mounting interfaces

    如若封裝不當,會使器件產生過大的應力,使晶元、封裝微、漏氣,導器件失效。
  5. Insurance ploicies or certificate in duplicate endorsed in blank of 110 % of invoice value covering all risks and war risks as per cic with claims payable at singapore in the currency of draft ( irrespective of percentage ), including 60 days after discharges of the goods at port of destination ( of at station of destination ) subject to cic

    保險單或保險憑證一式二份,空白背書,按發票金額加10 %投保,聲明在泰國賠付,根據中國人民保險公司1981年1月1日的海洋運輸貨物保險條款投保平安險,包括偷竊提貨不著,受船艙發汗,串味,鐵箍銹損,包裝所導的損失。
  6. Thermal and welding residual stress often produces in the proceeding of the electronic package, the residual stress release and thermal deformations of the microelectronics will reduce the assemble intensity between the chip and package, and then debase the electrical performance of the assemble circuit, numerous thermal cycling will lead to thermal fatigue or thermal failure of the microelectronics

    電子封裝器件在生產的工藝過程中,往往會產生殘余應力以及焊接殘余應力,殘余應力的釋放作用及器件在使用過程中的變形,會降低集成電路晶元與封裝體的結合強度,進而降低集成電路的電性能,反復的循環,將導器件的疲勞失效,嚴重時可導矽片或陶瓷片,使整個器件遭到壞。
  7. Crucible 416r should be forged at 2050 to 2150 f ( 1121 to 1177 c ) and finished above 1400 f ( 760 c ). crucible 416r is not adaptable to severe upset forging operations

    在小弟我以前做事的鑄造工廠,只要是碰到3字頭與4字頭鑄件變形,都需要處理后才能整形.要不然內部會產生應力導鑄件
  8. One is that output window is cracked by the arcing on the surface of output window resulted by the secondary - electron, the other is that the stresses result from intense local heating produced by the power dissipation due to the loss factor of dielectric of the output window cause the output window to rupture 2. the second problem is now discussed in this dissertation

    這就會導輸出窗片溫度過高,應力過大。當窗片的應力超出它的承受能力時,窗片就會。因此,有必要對輸出窗進行分析研究,為輸出窗的設計提供理論依據。
  9. Heat causes the chemical bonds in cells to break down, a disruption that can be a potential trigger for cancer

    會導細胞內化學鍵的斷,這種壞可能是癌證的潛在誘因。
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