粘接失效 的英文怎麼說
中文拼音 [niánjiēshīxiào]
粘接失效
英文
fail in bond-
The circulation function therapeutic instrument of brain based on direct digital synthesis ( dds ) technology uses the domestic newest scientific findings and others in foreign countries. adopting the dds technology directly, it produces the safe, valid treatment. through pasting heart electric electrode on body surface, it introduces electric current to cerebral fastigial nucleus ( fn ) without damage in order to improve the state of brain blood supply and nerve conducted and something of lacking proper care to lose the symptom of coordinating with a net, increase cerebral blood flow, reduce downright bad neuron figure, district of penumbra, lighten brain perinemotoma
基於直接數字頻率合成技術的智能腦電治療儀應用國內國際上最新科研成果，採用直接數字頻率合成技術，實現安全、有效的治療，通過粘貼于體表的電極，無創引入小腦頂核，從而改善腦供血狀態和神經傳導失調失絡癥狀，增加大腦血流量，減少半影區壞死神經元數目，減輕腦水腫，最終達到改善腦循環功能的作用。By investigating the results from the theoretical analysis and the comprehensive property tests, the service life of these motors were evaluated and it was found that the factor determing the service life of these motors is the misfunction of the binding interfaces
比較理論分析和綜合性能試驗的結果，對該型發動機服役壽命進行了評估，發現決定其壽命的因素是粘接界面的失效。Rubber components often appear interface failure due to the actions of mechanical loads and the influences of enviorment. hence, in this paper the interface failure mechanism has been studied by means of finite element method and fracture machinics. the numerical results of testpieces deformation with crack are in close agreement with experimental values
橡膠鋼雙材料試件由於機械載荷和環境的影響經常在粘接界面發生破壞而導致結構失效，藉助有限元和斷裂力學對界面破壞機理進行研究，得到的存在初始裂紋的試件變形與實驗結果吻合較好。However, the die attach layer delaminated after 500 cycles and pcb cracked in the underfilled samples after long time cycling. c - sam is employed to investigate the delamination in the underfilled samples. highly concentrated stress - strain induced by the cte mismatch between the bga component and the pcb board, coarsened grain and two kinds of intermetallic compounds ( nisn / nisns ) which formed during reflow and thermal cycle and their impact on the reliability of solder joints are discussed in this paper
充膠樣品粗化尤為嚴重； ? ni - sn金屬間化合物包括兩層：其中，靠近ni焊盤的那層比較平整，同時， eds結果分析表明其化學式近似為nisn ，而靠近焊料的那層呈板條狀，化學式近似為nisn _ 3 ，文獻表明其為亞穩相； ?充膠使得樣品最大應力范圍降了接近一個數量級並降低了dnp的作用，同時，器件失效模式變為晶元粘接層分層； ? c - sam結果表明本論文採用的充膠樣品，晶元粘接層分層起始於500周左右，而經過2700周循環的樣品，分層幾乎擴展到整個界面。The heating double - clip connected ball valve enjoys favorable heat / cold preservation performances which not only effectively prevent the slabby medium in pipelines from solidifying but also reduce the heat loss of the medium in pipelines
而保溫對夾連接球閥良好的保溫保冷特性既能有效防止管路中粘稠介質凝固，又能降低管路中介質熱量的損失。Standard practice for time - to - failure creep - rupture of adhesive joints fabricated from epdm roof membrane material
由epdm屋頂膜材料製造的膠粘劑接頭的失效時間分享友人