flip-chip bonder 中文意思是什麼
flip-chip bonder
解釋
倒裝焊接器-
In this thesis, the work on automatic alignment system is as follows : firstly, after the methods and optical systems for alignment whose are used commonly now are discussed, a new die leveling method based on auto - focus is presented for the flip chip bonder. auto - focus is completed by estimating from images ; die leveling is completed by focusing for several feature locations
本文針對倒裝貼片機的自動對準系統開展了以下幾方面的工作:首先在討論了現有的對準方法和自動貼片機的對準光路系統基礎上，針對貼片機實際應用環境，提出基於多點自動對焦的晶元調平方法。 -
An automatic flip chip bonder is a precision instrument used to align and bond one or more dies onto a substrate in semiconductor industry. it develops for the mass production of ic, mems and moems with small feature sizes and high precise bonding demands. an alignment system is one of the key components in flip chip bonders
全自動倒裝貼片機（ flipchipbonder ）是半導體生產工藝中完成晶元和基底對準、鍵合的高精度自動化設備，適合於特徵尺寸小，鍵合精度要求高的ic （ integratedcircuit ） 、 mems （ microelectromechanicalsystem ） 、 moems （ microopticalelectromechanicalsystems ）等的大規模生產。 -
Design and realization of machine vision system in thermosonic flip - chip bonder
熱超聲倒裝鍵合機視覺系統的設計與實現
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