flip-chip 中文意思是什麼

flip-chip 解釋
觸發器雙穩態多諧振蕩器
  • flip : vi （ pp ）1 用指頭彈；輕輕打。2 （用鞭子等）抽。3 叭嗒叭嗒地動；翻動紙張。4 跳上車。5 起強烈反應...
  • chip : n 1 碎片，削片，薄片；碎屑；薄木片；無價值的東西。2 （陶器等的）缺損（處）。3 （賭博用）籌碼；〈p...
  1. The reworkable underfills technology for flip chip

    倒裝晶元的可修復底部填充技術
  2. Research on the thermode bonding procee for flip chip

    倒裝晶元熱電極鍵合工藝研究
  3. Implementation of flip chip and chip scale technology

    叩焊晶片和晶片標度技術的執行
  4. Flip chip will be a new method of packaging technology

    倒裝晶元將成為封裝技術的最新手段
  5. Bump fabrication methods for flip chip

    倒裝晶元凸點製作方法
  6. Screen printing technology for solder ball flip chip for smt

    倒裝晶元及晶圓和基底凸起的網版印刷技術一
  7. Flip chip bonding technology used in modern micro - photoelectron package

    現代微光電子封裝中的倒裝焊技術
  8. Fcpga flip chip pin grid array

    反轉晶元針腳柵格陣列
  9. Flip chip underfill technology

    的晶元倒裝技術
  10. According to the m1l - std - 883c standard of thermal cycle loading, the delamination propagation rates at the interface between chip and underfill were studied experimentally by using c - mode scanning acoustic microscope ( c - sam ) for two types of flip chip packages with different states of solder joint

    採用mil - std - 883c標準，通過溫度循環實驗，使用高頻超聲顯微鏡（ c - sam ）無損檢測技術，測量了在不同焊點狀態下， b型和d型兩種實際倒裝焊封裝晶元與底充膠界面分層裂縫傳播速率。
  11. In this thesis, the work on automatic alignment system is as follows : firstly, after the methods and optical systems for alignment whose are used commonly now are discussed, a new die leveling method based on auto - focus is presented for the flip chip bonder. auto - focus is completed by estimating from images ; die leveling is completed by focusing for several feature locations

    本文針對倒裝貼片機的自動對準系統開展了以下幾方面的工作:首先在討論了現有的對準方法和自動貼片機的對準光路系統基礎上，針對貼片機實際應用環境，提出基於多點自動對焦的晶元調平方法。
  12. An automatic flip chip bonder is a precision instrument used to align and bond one or more dies onto a substrate in semiconductor industry. it develops for the mass production of ic, mems and moems with small feature sizes and high precise bonding demands. an alignment system is one of the key components in flip chip bonders

    全自動倒裝貼片機（ flipchipbonder ）是半導體生產工藝中完成晶元和基底對準、鍵合的高精度自動化設備，適合於特徵尺寸小，鍵合精度要求高的ic （ integratedcircuit ） 、 mems （ microelectromechanicalsystem ） 、 moems （ microopticalelectromechanicalsystems ）等的大規模生產。
  13. As an electric current passes through, the joule heating and electromigration effects occur in the flip chip solder bumps

    當電流通過焊點時，會伴隨產生焦耳熱效應和電遷移效應。
  14. Promote the manufacture of high value - added products, e. g. wafer fabrication, flip chip technology

    -增加了高附加值產品的生產，如無線電晶片、晶元等
  15. Flip chip technology has become one of the major joining technologies in electronic packaging

    摘要覆晶技術已成為電子構裝中之主要接合技術之一。
  16. Air lift flip chip

    氣頂升倒裝法
  17. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages

    完成某集成電路封裝（叩焊晶元）內部實際的電氣連接的焊料中的鉛。
  18. Design and realization of machine vision system in thermosonic flip - chip bonder

    熱超聲倒裝鍵合機視覺系統的設計與實現
  19. To our knowledge, for real flip chip packaging under the thermal loading, the paris equation obtained from experiment da / dn and simulation g is firstly reported here, and will be useful practically

    本文在熱循環加載條件下對實際倒裝焊封裝給出實驗da / dn和模擬g關系的paris方程，屬首次報導。
  20. Then, the half - empirical paris equation, which can be used as a design base of flip chip package reliability, have been determined from the crack propagation rates da / dn measured and the energy release rates g simulated

    然後由實驗測得界面裂縫擴展速率和有限元模擬給出的能量釋放率，擬合得到可作為倒裝焊封裝可靠性設計依據的paris半經驗方程。
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