process of lapping 中文意思是什麼

process of lapping 解釋
研磨過程
  • process : n 1 進行，經過；過程，歷程；作用。 2 處置，方法，步驟；加工處理，工藝程序，工序；製作法。3 【攝影...
  • of : OF ＝Old French 古法語。
  • lapping : 擦準
  1. Our extensive wafer manufacturing expertise qualifies us to provide wafer sub - contract services for a wide variety of crystal materials. ingot slicing and grinding, wafer lapping and polishing are process we can provide on a sub - contract basis

    我們淵博的晶圓製造專業為晶體材料同業提供多種晶圓代工服務。項目包括晶棒切割與成型、晶片研磨與拋光。
  2. There exist large stress, intensive scratch, damage and pollution of ion in wafer process, so it is necessary to improve mechanism of slicing and lapping by changing single mechanical function to equilibrium chemical and mechanical function for small damage and low stress. reducing damage and stress and enhancing quality and efficiency of product result in a base of followed process so as to improve wafer process and enhance finished product ratio of whole wafer process

    目前加工過程中存在應力過大，造成表面劃傷嚴重，容易產生破損，離子沾污的問題，因而必須改善切削、研磨機理，把單一的機械作用變為均勻穩定的化學機械作用，以達到淺損傷、低應力的目的，有效的減少破損層和應力的累積，提高產品質量和加工的效率。
  3. We effectively solve the stress of wafer process and prove the function of the new slicing slurry and lapping slurry in wafer process. research fruit is applied to manufacture

    在實驗部分中我們有效地解決了矽片加工的應力問題，驗證了新型切削液和研磨液在矽片加工過程中的明顯作用，並使研究成果投入生產轉化為產品。
  4. When the eccentricity distance is different, the distribution form of average pressure density in machining zone is given. in the lapping and polishing experiment, sic materials can be evenly removed by choosing reasonable process conditions and parameters, and the surface will convergence to prefect shape. this is helpful to the study on quantificational machining technologies of aspheric components

    主要內容和創新點包括： 1 、根據平面研拋的成形原理和材料去除特點，建立了工件表面相對運動軌跡的數學模型，給出了不同偏心條件下加工區域的平均壓強分佈形式；在sic工件的平面研拋實驗中，通過選擇合適的加工條件和對工藝參數進行調整，能夠實現表面材料的均勻去除，獲得理想的工件面形，同時也為非球面確定量研拋提供工藝指導。
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