磨輪轉軸 的英文怎麼說

中文拼音 [mólúnzhuǎnzhóu]
磨輪轉軸 英文
wheel spindle
  • 磨 : 磨動詞1 （摩擦） rub; wear 2 （研磨） grind; mull; polish 3 （折磨） grind down; wear down [out]:...
  • 輪 : Ⅰ名1 （輪子） wheel 2 （像輪子的東西） wheel like object; ring; disc 3 （輪船） steamer; steamboa...
  • 轉 : 轉構詞成分。
  • 軸 : 軸Ⅰ名詞1. （圓柱形的零件） axle; shaft 2. （對稱部分的直線） axis 3. （圓柱形的纏繞器物） roller; spool Ⅱ量詞（用於纏在軸上的線以及裝裱帶軸子的字畫）
  • 輪轉 : rotate; [計算機] round robin 輪轉計 trocheameter; odometer; 輪轉印刷機 rotary machine; rotary pre...
  1. Grinding feature is to use work piece for a slow - speed operation, and wheel spindle selects a high - speed revolution and offers a minor amount of in - feed to cooperate with mechanical spinde for forward and backward movement for finishing grinding jobs

    研磨特性是利用工作物做慢速運轉，而砂輪心軸采高速回轉並給予微量進刀配合機械心軸前後運動完成研磨作業。
  2. Through the running of double spindle grinder, two surfaces on work piece will be ground together and finished at the same time

    對軸式鑲盤砂輪disc主要功能是藉由機械運轉，將工件兩個平面同時研磨加工完成。
  3. The results show that, when increasing the feed rate of the grinding wheel, decreasing the rotating speed of the wafer chuck table and using coarser grit grinding wheel, the material removal rate in the wafer rotating grinding increase, the feed rate of the grinding wheel has greater influence on the material removal rate ; when suitably increasing the rotating speed of the grinding wheel, decreasing the feed rate of the grinding wheel and using finer grit grinding wheel, the wafer surface roughness can be reduced ; there exists a critical rotating speed of the grinding wheel ( about 2300rpm ), beyond which the material removal rate evidently decreases and the spindle motor current and wafer surface roughness steeply increase ; when the grit size of the grinding wheel is finer than # 2000, the material removal rate decreases and the wafer surface roughness has no obvious improvement

    研究結果表明，增大砂輪軸向進給速度和減小工件轉速，採用粗粒度砂輪有利於提高磨削矽片的材料去除率，砂輪軸向進給速度對材料去除率的影響最為顯著；適當增大砂輪轉速，減小砂輪軸向進給速度，採用細粒度砂輪可以減小磨削表面粗糙度；在其它條件一定的情況下，砂輪速度超過一定值會導致材料去除率減小，主軸電機電流急劇增大，表面粗糙度變差；採用比# 2000粒度更細的砂輪磨削時，材料去除率減小，矽片表面粗糙度沒有明顯改善。
  4. By using a wafer - rotating grinding machine, the influence of the main process factors including grit size of diamond grinding wheel, rotating speed of the wafer chuck table, rotating speed and the down feed rate of the cup grinding wheel on the material removal rate, spindle motor current and wafer surface roughness in grinding large size wafer are experimentally investigated

    摘要利用基於自旋轉磨削原理的矽片超精密磨床，通過試驗研究了砂輪粒度、砂輪轉速、工件轉速及砂輪進給速度等主要因素對材料去除率、砂輪主軸電機電流以及磨削后矽片表面粗糙度的影響關系。
  5. Surface grinding machines with vertical grinding wheel spindle and rotary table - testing for the accuracy

    帶立式磨輪軸和旋轉工作臺的平面磨床.精度檢驗
  6. The numerical simulation and experimental research made on the characteristics of the clearance cavitations in kaplan turbine are described herein ; in which the analysis mainly is concentrated on the characteristics of leakage - vortex caused by the flow of the clearance between blade tip and blade chamber, that occurs at the front - pressure side of the blade, and the intensity of the secondary - flow - vortex ; furthermore, the relationship in between the leakage - vortex, secondary flow vortex, cavitations and erosion are analyzed as well

    摘要對軸流轉槳式水輪機輪緣間隙流動及空化特性進行數值模擬和試驗研究，重點分析輪緣間隙流動在正面頭部泄漏流動所引起的泄漏渦帶、二次流動的漩渦強度和空化特性，以及泄漏渦帶旋轉、二次流動的漩渦與空蝕和磨損之間的關系。
  7. This paper analyzes and discusses the problems involving the design of the electronic control ( ec ) and numerical control ( nc ) systems for a new type nc grinder - machine used to grind planar quadratic and annular enveloping worms based on novel four - axis - interpolation, in which a central fabricating method is introduced

    摘要本文作者設計了新型四聯動平面二次包絡蝸桿數控磨床的數控及電控系統，該磨床採用虛擬中心的方法，通過兩正交軸的圓插補及磨頭基座的自轉實現了傳統蝸桿加工磨床上的砂輪工作面的平面回轉運動，克服了傳統加工蝸桿工作層面多，結構復雜，加工精度、效率低等缺點。
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