軸向磨削 的英文怎麼說

中文拼音 [zhóuxiàngxiāo]
軸向磨削 英文
axiales schleifen axial grinding
  • : 軸Ⅰ名詞1. (圓柱形的零件) axle; shaft 2. (對稱部分的直線) axis 3. (圓柱形的纏繞器物) roller; spool Ⅱ量詞(用於纏在軸上的線以及裝裱帶軸子的字畫)
  • : 磨動詞1 (摩擦) rub; wear 2 (研磨) grind; mull; polish 3 (折磨) grind down; wear down [out]:...
  • : 削動詞1. (用刀斜著去掉物體的表層) pare [peel] with a knife 2. (乒乓球的一種打法) cut; chop
  1. Disk chuck has been adopted in 74 series vertical shaft rotary die grinders, which can grind to the internal hole, excircle of large workpieces and workpieces with shoulders. die can work and grind to r - arc without removing guede - pole, and grinder head can rotate in the range from + 45o to - 45o. accordingly, the life of die is longer than before and accuracy of the die is stable

    74系列立圓臺模具床採用花盤式工作臺,可對較大工件內孔、外圓和帶有臺肩的工件進行,沖模模具可以不拆導柱進行及r弧,提高模具使用壽命,保證模具使用精度,頭可旋轉45 。
  2. Tile cutting disks, deep drawing tools, plain bearings, sealing and sliding sealing rings, guide gibs, liners and bushings, shaft protective sleeves, rolls for cold rolling mills, tools for diecasting pulverized materials, cutting disks

    飾面花磚切盤、深拉工具、滑動承、密封圈和滑動密封圈、導槽、襯墊和套、曲柄套、冷壓碎機軋輥、硬模鑄造研材料的工具、刀盤。
  3. The results show that, when increasing the feed rate of the grinding wheel, decreasing the rotating speed of the wafer chuck table and using coarser grit grinding wheel, the material removal rate in the wafer rotating grinding increase, the feed rate of the grinding wheel has greater influence on the material removal rate ; when suitably increasing the rotating speed of the grinding wheel, decreasing the feed rate of the grinding wheel and using finer grit grinding wheel, the wafer surface roughness can be reduced ; there exists a critical rotating speed of the grinding wheel ( about 2300rpm ), beyond which the material removal rate evidently decreases and the spindle motor current and wafer surface roughness steeply increase ; when the grit size of the grinding wheel is finer than # 2000, the material removal rate decreases and the wafer surface roughness has no obvious improvement

    研究結果表明,增大砂輪進給速度和減小工件轉速,採用粗粒度砂輪有利於提高矽片的材料去除率,砂輪進給速度對材料去除率的影響最為顯著;適當增大砂輪轉速,減小砂輪進給速度,採用細粒度砂輪可以減小表面粗糙度;在其它條件一定的情況下,砂輪速度超過一定值會導致材料去除率減小,主電機電流急劇增大,表面粗糙度變差;採用比# 2000粒度更細的砂輪時,材料去除率減小,矽片表面粗糙度沒有明顯改善。
  4. Intelligent prediction and control system of shaft workpiece size in cylinder traverse grinding

    類零件外圓縱尺寸智能預測和控制系統
  5. Adopted auto - shadowing cut - grinding system to ensure pressure angle, axis power and radial power in a best position

    採用自動跟蹤系統,確保壓力角力徑力最佳。
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