金屬層 的英文怎麼說
中文拼音 [jīnzhǔcéng]
金屬層
英文
metal level-
All the alkali metals have a single s-electron outside a closed shell.
所有的堿金屬都在閉合殼層之外有一單個S電子。All the alkali metals have a single s - electron outside a closed shell
所有的堿金屬都在閉合殼層之外有一單個s電子。By using one - dimensional finite different hydrodynamic code coupled with four spall models, spall in ductile metal has been studied
摘要在平面一維彈塑性流動有限差分計算程序中加入4種延性金屬層裂模型,對平板撞擊層裂實驗進行數值模擬。Building directly on these 2 - d technologies, we have made 3 - d circuits by coating standard silicon wafers with many successive layers of polysilicon ( as well as insulating and metallic layers ), polishing the surface flat after each step
利用這些傳統的二維晶片技術,我們已做出三維電路:在標準的矽晶圓上,連續鍍上好幾層的多晶矽及絕緣層與金屬層,每一層鍍完后,都磨光晶圓表面。Mmlhc mixed metal layer hydroxide compound
混合金屬層狀氫氧化物Mmlh mixed metal layer hydroxide compound
混合金屬層狀氫氧化物Mmlh ? mixed metal layer hydroxide compound
混合金屬層狀氫氧化物Wirings of the poly layer are always utilized under the silicon grid technics. to control the macro - cell signal delay and improve signal integrality, the crossing among different nets must be averagely distributed to reduce the number of layer permutation. the metal layer wirings should be maximized and the length of poly layer wiring in each net should be minimized
硅柵工藝晶體管級布線利用多晶層走線,為了控制宏單元時延性能及改善信號完整性形態,關鍵是不同線網間交叉的均衡分配以減少走線的換層次數,最大化金屬層走線以及每一線網多晶層走線長度的有效控制。Less energy is lost this way than the use of a mirror, which absorbs energy during both transmission within the mirror material and reflection from the thin metallic film on the back of it
光能損失較普通玻璃鏡少,因為普通玻璃鏡會在傳送在鏡的物質里和反射由鏡背的薄金屬層過程中吸去能量。The clad diamond with multilayer films of metals, alloys or metalceramics are manufactured by low - temperature plasma composite technology
採用該技術可以在單晶金剛石顆粒表面獲得強力結合的多層金屬層、合金層及陶瓷塗層。The improved neural network is applied in study of the relationship between reaction parameters of electroless plating nickel in the process of the metallization of aluminum nitride and the adhesion strength between the metal layer and the substrate
為得到較大的氮化鋁金屬化層粘附力,運用基於穩健估計的神經網路研究氮化鋁金屬化中化學鍍鎳的反應參數與金屬層粘附力的關系。The anti - burnout character was improved obviously after the metallization be made more thick. the analysis on the gaas mmic metallization which burnout has been occured proved that the main reason was that the metallization is too thin to endure the mechanical stress, so the collapse will trigger the circuits burnout
對gaasmmic互連出現的燒毀現象的顯微分析表明,主要是空氣橋金屬化層過薄,尤其是搭接處易出現塌陷,金屬層加厚后,互連線的燒毀能力有明顯改善。Current research on the reaction between solder bump and under bump metallurgy systems in flip chip
倒裝晶元中凸點與凸點下金屬層反應的研究現狀On the contrary, the resistively ratio of the ndfeb permanent magnetic powders cladded by copper was lowest
粘接ndfeb磁體的電阻率表現為ndfeb磁粉和包覆金屬層的混合電阻率。Metallic multilayer plain bearings - method for destructive testing of bond for bearing metal layer thickness 2 mm
多層金屬滑動軸承.第2部分:厚度為2mm的軸承金屬層粘合力的破壞性試驗方法Welding consumables. wire electrodes and deposits for gas shielded metal arc welding of non alloy and fine grain steels. classification
焊接消耗材料.非合金鋼和細晶粒鋼的氣保護金屬電弧焊用絲狀電極和沉積金屬層的分類The diamond crystal is coated with ni, which can increase the cohesive strength between bond and diamond, it also prolongs the life of tools
在金剛石晶體表面鍍上一層鎳金屬層,增加磨料與結合劑之間的結合力,提高工具的壽命。The book also considers forming technologies for various composite material forms including thermoset and thermoplastic prepreg, molding compounds, and composite / metal laminates
該書還認為成形技術,為各種復合材料的形式,包括熱固性和熱塑性預浸料,成型化合物,並復合/金屬層板。“ ouslan ” the thermal insulation layer uses the rare metal completely, and uses the even coating technology, spreads evenly the conductive sea the cloth on the basement membrane, will cause it to occupy in the sunlight the main quantity of heat to reflect a part, to absorb a part, simultaneously will transmit a part, will create an independent cool world for you
隔熱層全部採用稀有金屬,並採用均勻鍍膜技術,將金屬層均勻塗布在基膜上,使其將占太陽光中主要熱量反射一部分、吸收一部分,同時傳遞一部分,為您創造一個獨立的清涼世界。Thin - film area : the area to deposit " dielectric layer " and " metal layer " as the conducted or insulated films, also has cmp ( chemical - mechanical _ polish ) to planarize the chips on the wafer ' s surface and add high ( low ) temprature rtp ( rapid - thermal - process ) to the wafer
薄膜區:專門沉積「介電層」 , 「金屬層」等導電或不導電薄膜的區域,併兼做晶圓表面器件之平坦化及高(低)溫快速熱退火製程。分享友人