銅化合物 的英文怎麼說
中文拼音 [tónghuàgěwù]
銅化合物
英文
copper compound-
Standard practice for sampling of blister copper in cast form for determination of chemical composition
泡銅鑄造化合物組成測定取樣的標準規程In at last, on base of electropolymerization of urushiol, electropolyurushiol / cus hybrid film ( hybrid - epu / cus ) was manufactured by the method of ion exchange process. then hybrid - epu / cus was characterized by ft - ir, fluorescence, dmta xrd and tem
最後，本文在電化學聚合漆酚的基礎上，用電化學聚合漆酚銅配合物，在一定條件下與nfos作用，可獲得聚合漆酚納米clls雜化材料。Film forming mechanism of imidazole on copper surface
咪唑化合物在銅表面的成膜過程與機理They immersed a lead object first in copper acetate ( a compound made by letting vinegar corrode copper ), and then in a silver solution created by dissolving silver chloride in dilute ammonia ( which ancient chemists made from urine )
它們首先把鉛製品浸沒在醋酸銅（通過醋酸腐蝕銅而制得的化合物）中，然後放在銀溶液中，銀溶液是通過把氯化銀溶解在稀釋的氨水（古代化學家從尿中制得）中而制得的。Base materials for printed circuits. part 2 : specifications. specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test
印刷電路用基材.第2部分:規范. 18號規范:規定易燃性的雙馬來酰亞胺三嗪改良型環氧化合物機織玻璃纖維織物包銅層壓板Base materials for printed circuits. part 2 : specifications - specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test
印刷電路用基材.第2部分:規范. 18號規范.規定易燃性的雙馬來酰亞胺三嗪改良型環氧化合物機織玻璃纖維織物包銅層壓板Test method for valency state of the arsenic component of ammoniacal copper arsenate solutions
氨銅砷酸鹽溶液砷化合物化合價狀態測試方法The process and mechanism of ball bonding were studied in this paper, specifically, intermetallic compounds ( imc ) formation and reliability on copper wire and aluminum alloy pad bonding joint during thermal aging were analyzed in detail
本文在對銅絲球鍵合工藝和原理研究的基礎上，著重分析了老化過程中銅絲球與鋁合金焊盤鍵合的金屬間化合物生長及可靠性。A reliability experiment of thermal aging was carried out for the two types of joints, scanning electron microscopy, energy dispersive x - ray spectrometer and micro x - ray diffractomer were adopted to investigate the interfacial evolution behavior of joints, and kinetics model of imc formation was established. the results show that imc growth follows the parabolic law as a function of aging time at certain aging temperature, imc growth is more sensitive to the aging temperature than the aging time, the activation energy of cu - al imc growth is 97. 1kj / mol and the major forming cu - al imc are cual2 and cu9al4, the activation energy of au - al imc growth is 40. 1kj / mol and the main au - al imc are au4al and au5al2, with au2al and aual at the interfacial periphery of joints, the rate of cu - al imc growth is about 1000 times slower than that of au - al imc, and kirkendall voids and cracks are easily appeared during thermal aging in gold ball bonds while voids and cracks are absent in copper ball bonds even after aging at 200 for 2900 hours and 250 for 169 hours
研究結果表明:金屬間化合物厚度與老化時間的關系符合拋物線法則，金屬間化合物的生長對老化溫度比老化時間更加敏感; cu - al金屬間化合物生長的激活能為97 . 1kj / mol ，老化后金屬間化合物呈層狀分佈，主要相為cual2和cu9al4 ; au - al金屬間化合物生長的激活能為40 . 1kj / mol ，主要相為au4al和au5al2 ，同時在界面周邊區域生成了au2al和aual ;老化過程中cu - al金屬間化合物生長速率比au - al金屬間化合物生長速率小103數量級;金絲球鍵合點200老化96小時出現了明顯的kirkendall空洞和裂紋，但銅絲球鍵合點200老化2900小時和250老化169小時都沒有形成空洞和裂紋。The efficiency of the sample made in alkaline catalyst is 79 % and a first charge capacity of 201. 2mah ? g ~ ( - 1 )
在900條件材料出現了一定量的硅銅金屬間化合物（ cu3si相） ，但材料的電化學性能沒有明顯提高。Gold and silver gilding techniques in the western han dynasty of china
兩件西漢時期鎏金與鎏銀青銅器鍍層中的金屬化合物Abstract : from the angle of the functional requirement for underwear and outwear, this paper analyses the properties of anti - microbial and occlusion fabric produced from copper and polar amino acid of silks complex emetic reaction to distributed by cu s crystal on the surface of silk. it made a study on the producing method of elastic fabric and indicates the common problems in both production and design
文摘:從內衣對真絲的功能性要求及外衣對真絲綢成形能力的要求切入，介紹了利用銅化合物與桑蠶絲中的極性氨基酸發生絡合反應，在纖維表面形成硫化銅晶體得到抗菌導電真絲的原理和效果，還介紹了生產彈性真絲織物的幾種方法和影響織物彈性、服用效果的因素，提出了在生產、設計彈性真絲織物過程中應注意的主要問題。Base materials for printed circuits. part 2 : specifications. specification no 4 : epoxide woven glass fabric copper - clad laminated sheet, general purpose grade
印製電路基材.第2部分:規范.第4號規范:普通級環氧化合物編織的玻璃纖維覆銅層壓板Insulating and sheathing materials of electric and optical cables - common test methods - methods specific to polyethylene and polypropylene compounds - tensile strength and elongation at break after conditioning at elevated temperature - wrapping test after conditioning at elevated temperature - wrapping test after thermal ageing in air - measurement of mass increase - long - term stability test - test method for copper - catalyzed oxidative degradation
電纜和光纜的絕緣和護套材料.通用試驗方法.聚乙烯和聚丙烯化合物專用方法.高溫處理后抗拉強度和斷裂伸長度.高溫處理后的卷繞試驗.在空氣中熱老化后的卷繞試驗.質量增加的測量.長期穩定性試驗.催化銅氧化降解的試驗方法Preparation of chitosan schiff base copper complexs and their catalytic properties
殼聚糖希夫堿銅配合物的制備及其催化性能Insulating and sheathing materials of electric and optical cables - common test methods - part 4 - 2 : methods specific to polyethylene and polypropylene compounds - tensile strength and elongation at break after conditioning at elevated temperature - wrapping test after conditioning at elevated temperature - wrapping test after thermal ageing in air - measurement of mass increase - long - term stability test - test method for copper - catalyzed oxidative degradation
電纜和光纜的絕緣和護套材料.通用試驗方法.第4 - 2部分:聚乙烯和聚丙烯化合物專用方法.高溫處理后抗拉強度和斷裂伸長度.高溫處理后的卷繞試驗.在空氣中熱老化后的卷繞試驗.質量增加的測量.長期穩定性試驗.催化銅氧化降解的試驗方法Base materials for printed circuits - part 2 : specifications - specification no 9 : epoxide cellulose paper core, epoxyde glass cloth surfaces copper - clad laminated sheet of defined flammability vertical burning test
印刷電路用基材.第2部分:規范. 9號規范.規定易燃性的環氧化合物纖維素紙芯環氧化合物玻璃布麵包銅層壓板Base materials for printed circuits. part 2 : specifications. specification number 9 : epoxide cellulose paper core, epoxyde glass cloth surfaces copper - clad laminated sheet of defined flammability vertical burning test
印刷電路用基材.第2部分:規范. 9號規范:規定易燃性的環氧化合物纖維素紙芯環氧化合物玻璃布麵包銅層壓板Base materials for printed circuits ; part 2 : specifications ; specification no. 9 : epoxide cellulose paper core, epoxide glass cloth surfaces copper - clad laminated sheet of defined flammability vertical burning test
印製電路用基材.第2部分:規范.第9號規范:規定易燃性的環氧化合物纖維素紙芯的環氧化合物玻璃布表面覆銅層壓板. 5 base materials for printed circuits - part 2 : specifications ; specification no. 9 : epoxide cellulose paper core, epoxide glass cloth surfaces copper - clad laminated sheet of defined flammability vertical burning test ; amendment 5
印製電路用基材.第2部分:規范.第9號規范:規定易燃性的環氧化合物纖維素紙環氧玻璃布表面銅覆層壓板分享友人