矽片 的英文怎麼說

中文拼音 [xīpiān]
矽片 英文
silicon pellet; silicon slice; silicon wafer; chip of silicon
  • 矽 : 名詞[化學] （硅的舊稱） silicon （si）
  • 片 : 片構詞成分。
  1. The annihilation of the octahedron voids at the tips of fpds was divided two processes : ( 1 ) the oxide on the void was removed by the out - diffusion of oi in the shallow region, especially the oi aroud the void and by the entry of the interstitial si atomics. ( 2 ) the void without oxide shrinked by emitting vacances and the migration of silicon atoms from edge to the bottom of void

    Fpds端部八面體空洞的消失分為兩個階段： （一）覆蓋在空洞各個內壁上的氧化膜由於高溫下矽片表面區域的間隙氧原子，尤其是空洞型缺陷周圍的間隙氧原子的外擴散及自間隙硅原子的進入，而逐漸變薄直至最終消失。 （二）無氧化膜的空洞，在高溫下發出一個個空位，同時八面體空洞周圍的自間隙硅原子不斷的從空洞的邊緣遷移至空洞的底部，使空洞逐漸變淺直至最後消失。
  2. Effects of silicon surface morphology on protein chelating

    矽片載體表面形貌對蛋白質吸附的影響
  3. What uses will they find for a silicon chip ?

    他們將為矽片找到什麼樣的用途？
  4. Corrosive effect of slurry inhibitor on copper wafer

    拋光液中緩蝕劑對銅矽片的影響
  5. In this paper, the flow pattern defects ( fpds ) were revealed by secco etchant and their shape, distribution on wafer and tip structure were studied in details by optical microscope and atomic force microscope ( afm ). the relationship between etching time and the tip structure of fpds was also discussed. furthermore, by studying the effect of rapid thermal annealing ( rta ) on the density of fpds in ar, the annihilation mechanism of fpds was discussed in this paper

    本文將cz硅單晶片在secco腐蝕液中擇優腐蝕后，用光學顯微鏡和原子力顯微鏡對流動圖形缺陷（ flowpatterndefects ， fpds ）在矽片中的形態、分佈及其端部的微觀結構進行了仔細地觀察和研究，並討論了腐蝕時間對fpds缺陷端部結構的影響；本文還通過研究ar氣氛下快速退火（ rapidthermalannealing ， rta ）對fpds缺陷密度的影響，初步探討了fpds的消除機理。
  6. The final ic is made by sequentially transferring the features from each mask, level by level, to the surface of the silicon wafer.

    按照順序從每一塊掩膜版上將圖形一層一層地轉移到矽片的表面，就制得了成品集成電路。
  7. Silicon slices and wafers - measuring of diameter - micrometer method

    矽片直徑測量方法千分尺法
  8. The silicon chips are less than a millimeter thick

    這些矽片厚度不足一毫米。
  9. Mlg series ultrasoning system is designed by our compeny, combining with the advantages of foreign and domestic trades. the instrument id mainlu used is single monocrystal silicon sheet, electric parts, lens, hardware and precision mechanical parts

    Mlg系列超聲波清洗系統，是本公司結合國外清洗機的特點精心設計，主要運用於單晶矽片、太陽能矽片、電子零件、光學鏡片等行業。
  10. " when a particle beam is directed toward a point on the surface, the gold atoms bounce off and expose the silicon layer underneath just like a hammer and chisel, " zohar said

    當粒子光束被導向于矽片表面的某一點，金原子反彈，露出底下的矽層，就像是鐵?與鑿子的作用，左哈爾說。
  11. Waxes for electron wafer binding : waxes for electron wafer binding, mainly used in precision process of micro electron wafer ( u piece, s piece or smd piece ), excellent strong adhesive ability, no scathe to element, cleanup easily after process

    電子晶片粘接蠟系列：主要用於微電子矽片或石英晶片（ u片、 s片或smd片）的精密加工，具有極強的附著力，對元件無任何損傷，使用后易去除。
  12. Sgrseries ultrasonic cleaning system is designed by our company, combining with the advantages of foreign and domestic trades. the instrument is mainly used is single monocrystal silicon sheet, electric parts, lens, hardware and precision mechanical parts

    Sgr系列超聲波清洗系統，是本公司結合國外清洗機的特點精心設計的，主要運用單晶矽片、電子零件、光學鏡片、小五金和精密機械零件等行業。
  13. Visual inspection for silicon wafers with specular surfaces

    鏡面矽片的目視檢查
  14. Personnel must wear proper clothing to protect the wafers.

    工作人員必須穿適當的服裝以保護矽片。
  15. The method is to coat a wafer of silicon with a protective layer of silicon dioxide.

    其方法是往矽片上塗上一層二氧化硅防護膜。
  16. " it took us about an hour to etch the 300, 000 words of the bible onto a tiny silicon surface, " ohad zohar, the university ' s scientific adviser for educational programs said

    擔任該所大學教育課程科學指導教授的左哈爾說?我們約費1小時，才將30萬字的聖經蝕刻在微小的矽片面上。
  17. According to theoretic and experimental investigation, crystal direction has nothing to do with forming square - holes

    通過理論和實驗研究，發現即使矽片晶向不準，仍能刻蝕出方孔列陣。
  18. The processes include the deposition of the waveguide film, the design and fabrication of the mask pattern, the lithography, the metal coating with a magnetic sputtering, the lift - off process for the metal mask, the dry deep etching by icp, the slicing of the wafer, the polishing of the cutting edge, the fiber - to - waveguide alignment and at last, the performance testing. some edg chip samples are fabricated

    對設計好的集成波導器件，本論文設計並試驗了器件的製作的全部工藝，包括波導薄膜的沉積，掩模的設計製作，光刻，濺射金屬薄膜，剝離法製作金屬掩模，干法深刻蝕，矽片切割，端面磨拋，波導對準和性能測試。
  19. Testing of semiconductor materials ; determination of the radial resistivity variation of silicon or germanium slices by means of the four - probe direct current method

    半導體材料試驗:採用四探針直流法測量矽片和鍺片電
  20. Our company is one of professional manufactures in china of semiconductors and solar battery cleaning equipments, our main products includes quartz tube cleaning machine, silicon wafer washing equipment, semiconductor wafer etching machine, nitrogen cabinet, dryer and so on

    我們是中國從事半導體、太陽能電池清洗設備的一家設備廠商，主要產品有石英管清洗機、矽片清洗機、矽片腐蝕機、氮氣存儲櫃、甩干機等產品。
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