集成電路晶片 的英文怎麼說

中文拼音 [jíchéngdiànlùjīngpiān]
集成電路晶片 英文
ic die
  • 集 : gatherassemblecollect
  • 成 : Ⅰ動詞1 （完成; 成功） accomplish; succeed 2 （成為; 變為） become; turn into 3 （成全） help comp...
  • 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
  • 路 : 1 （道路） road; way; path 2 （路程） journey; distance 3 （途徑; 門路） way; means 4 （條理） se...
  • 晶 : Ⅰ形容詞（光亮） brilliant; glittering Ⅱ名詞1. （水晶） quartz; （rock） crystal 2. （晶體） any crystalline substance
  • 片 : 片構詞成分。
  • 集成 : integration集成晶體管 integrated transistor; 集成元件 integrated component
  • 電路 : [訊] circuit （ckt）; electric circuit; electrocircuit電路板 circuit board; 電路保持 guard of a c...
  • 晶片 : chip; crystal plate; wafer
  1. Now that a single chip is an entire system ( the concept of system - on - a - chip, soc ), on - chip interconnect is now one of the most challenging areas of 1c processing

    隨著系統晶元的出現，片內互連技術已成為目前集成電路設計中最具挑戰性的領域之一。
  2. Chemical - mechanical - polishing ( cmp ) has been rapidly developing and finding extensive applications in the integrated circuit ( ic ) manufacturing industry for processing hard disk of computer and silicon wafer with super - smooth and flawless surface

    集成電路（ ic ）製造工業中，化學機械拋光（ chemicalmechanicalpolishing ， cmp ）廣泛應用於計算機硬盤片、硅晶片超光滑無損傷表面的加工。
  3. The liquid encapsulated czochralski technique for growing gaas is receiveing considerable attention because it is capable of producing, at reasonable cost, large diameter semi - insulating gaas has a use in the production of gaas integrated circuits, and for this application it must have uniform properties over the whole area of a wafer cut from a grown crystal

    目前，液封直拉技術生長gaas單晶獲得了廣泛關注，因為它能夠以合理的成本生產大直徑的半絕緣單晶。半絕緣材料是生產集成電路等微電子器件的良好材料，而這種應用就要求整個晶片具有很高的均勻性。
  4. Integrated circuit ( ic ) ： small wafers of silicon etched or printed with extremely small electronic switching circuits ; also called chips

    集成電路：刻有或者印有非常小的電子開關電路的小硅晶片；也稱作chips 。
  5. Integrated circuit design has entered into the era of system on chip ( soc ), the bus interconnect architecture of system on board have also developed into a kind of hierarchy architecture - on chip bus ( ocb )

    隨著集成電路設計進入到系統晶元（ soc ）時代，板極系統的總線互連結構也發展成為系統晶元的層次化總線體系一片上總線。
  6. In the designed hardware, at89c51 single chip computer and many kinds of new type circuit chip ( including : special power measuring chip - cs5460a, ds1302 calendar / clock chip, sms0601 lcd, x5045 serial memory ) are used for design. the hardware circuit is simplified, the meter ' s anti - interference ability is enhanced and the precision of measurement is also advanced

    設計中以at89c51單片機為核心，採用多種新型集成電路晶元（包括電能計量專用晶元cs5460a 、 ds1302日歷時鐘晶元、 sms0601液晶顯示器、 x5045串列存儲器）進行介面設計，簡化了硬體電路，提高了電能表的抗干擾能力和測量精度。
  7. The direct - nitridation of silicon wafer in nitrogen is very important because it involves in silicon wafer ' s heat treatment, ic technics and pulling monocrystal in nitrogen

    在矽片的熱處理、集成電路工藝和氮氣保護的拉晶過程中，都涉及到硅的氮化問題，因此矽片氮氣直接氮化的研究意義重大。
  8. Thermal and welding residual stress often produces in the proceeding of the electronic package, the residual stress release and thermal deformations of the microelectronics will reduce the assemble intensity between the chip and package, and then debase the electrical performance of the assemble circuit, numerous thermal cycling will lead to thermal fatigue or thermal failure of the microelectronics

    電子封裝器件在生產的工藝過程中，往往會產生熱殘余應力以及焊接殘余應力，殘余應力的釋放作用及器件在使用過程中的熱變形，會降低集成電路晶元與封裝體的結合強度，進而降低集成電路的電性能，反復的熱循環，將導致器件的熱疲勞失效，嚴重時可導致矽片或陶瓷片破裂，使整個器件遭到破壞。
  9. In this study, the design procedures for mitigating radiation effects mechanisms have been implemented in a gate array design, we have obtained samples of integrated circuits test structures manufactured by wuxi csmc - hj using their 0. 6 - m cmos process

    在研究中，我們將降低輻射效應的設計方法應用到門陣列設計中，獲得了華晶上華半導體有限公司採用0 . 6 m的cmos工藝生產的集成電路樣片，具有100krad （ si ）的抗總劑量輻射能力。
  10. The demand of the wafer ' s quality become higher too. the result of the final polishing determines the quality of silicon substrate for the final polishing is the last step in the polishing. in this paper, the mechanism and dynamics process of silicon polishing are systematically analyzed

    隨著集成電路向著甚大規模集成電路（ ulsi ）日新月異的發展，作為襯底材料的硅單晶片的尺寸越來越大，特徵尺寸也不斷減小，對硅襯底拋光片的拋光質量的要求也越來越高。
  11. Especially, mesfet devices fabricated on lec si - gaas substrate have been adopted into very large - scale integration ( vlsi ) and monolithic microwave integrated circuit ( mmic ) extensively. therefore, it is necessary to study the influence of defects in substrate material of lec si - gaas on performance of mesfet to meet the need of design and fabrication of gaas ic

    以液封直拉半絕緣gaas為襯底的金屬半導體場效應晶體管（ mesfet ）器件是超大規模集成電路和單片微波集成電路廣泛採用的器件結構，因此研究lec法生長si - gaas （ lecsi - gaas ）襯底材料特性對mesfet器件性能的影響，對gaas集成電路和相關器件的設計及製造是非常必要的。
  12. Fourthly, new type of keyboard circuits designed in this chip can save the system working time and reduce the power dissipation according to usual polling circuits. the chips are on two die of 2 * 2 mm2 using 0. 6um cmos mix - signal technology ( double well, double poly, double metal ) including sending part and receiving one respectively

    本晶元採用數模混合設計，參加了由上海集成電路中心（ icc ）組織的mpw （多晶圓）計劃，在無錫上華半導體有限公司流片，採用上華0 . 6um混合cmos工藝（準雙阱、雙層多晶硅、雙層金屬） 。
  13. Civil air defense alarm system was a system to dispense antiaircraft alarm sig - nal, hand hostile air attack informational communication to urbanite at wartime. it is a particular informational communication system of the civil air defense depart - ment, and can not be taken place. at the development trend of digitaliza - tion, unitization, integration of civil air defense communication, the civil air defense alarm system is developing too, for adaptation to the require of both future war and peaceful dual, and enhancing civil air defense communication system ' s directing automation. in recent years, development of different kinds of communication technology infuses new clearly energy into communication, especially spread spectrum communication, because of its strongly interference - free feature, invisibility best, realizable code division multiple access and antimultipath wane and so on merit, gets extensive use at wireless region ; the corresponding spread spectrum chips emerge as the times and get boom, which provides advantag e to realization of the circuit of spread spectrum communication. at the same time, in company with the advance of electronics level, the single chip microcomputer has a great development, world renowned chip manufacturer pushout respective products one after another, the kinds of which are too many to statiste

    在人防通信的數字化、一體化、綜合化必然的發展趨勢下，人防警報系統也不斷發展，以適應未來戰爭和和平時期的雙重需要，提高人防通信系統指揮自動化。近年來，各種通信技術的發展給通信注入了活力，擴頻通信更因其抗干擾能力強、隱蔽性好、可實現碼分多址和抗多徑衰落等優點在無線領域得到了廣泛應用；其相應擴頻處理晶元應運而生並得到迅速發展，這為擴頻通信的電路實現提供便利。同時隨著微電子工藝水平的提高，單片微型計算機有了飛躍發展，世界上著名的集成電路晶元製造商紛紛推出各自的產品，單片機型號之多，已達到難以統計的地步。
  14. This paper briefly introduces design method of the multi - function timing control unit. it is made of 89c51 and other integrate circuit chip, and produce the frame diagram for monitoring program

    摘要介紹了一種多功能定時控制器的設計方法。它是由89c51單片機和幾個主要的集成電路晶元構成。並給出了監控軟體的結構框圖。
  15. This smart power ic can be fabricated by normal cmos process. some details of the design, layout, tape - out and test are described in the main text

    該晶元屬于智能功率集成電路（ spic ） ，採用與普通cmos兼容的工藝，完成了從電路設計，版圖繪制到投片，測試等工作。
  16. As the density of very large - scale integration ( vlsi ) chips increases, the probability of introducing defects on the chips during the fabrication process also increase

    隨著超大規模集成電路晶元生產技術的發展，單片晶元的集成度越來越高。要想一次生產出沒有任何缺陷的晶元已不太可能。
  17. In this dissertation, a boa - type waveguide optic switch with double - heterostructure gaas / gaalas has been researched. gaas - based integrated optical devices have good temperature, good anti - radiation and optical - transmission characteristics, and also have wide transparent range of wavelength. they can also be integrated on a chip with optical active devices and electronic devices, such as semiconductor laser, optical modulation, optical amplifier, pin, and so on

    基於gaas材料的集成光學器件不僅具有良好的光傳輸特性、溫度特性、抗輻射能力和其較寬的透明波長范圍，還有望進一步實現晶元與光源、光調制器、光探測器和半導體光放大器等其它光電器件以及集成電路的單片集成；採用gaas gaalas雙異質結材料製作的光開關可以得到較低的開關電壓，而且採用gaas gaalas異質結材料的光傳輸損耗很小。
  18. Four - point probe measurement technique is one of the most extensive means for examining the resistivity in the semiconductor industry. with continuous progress, semiconductor industry develops at a very fast speed, the integration level of ic becomes higher and higher. presently, the ic production is entering into the age of ulsi, then testings are more and more important

    四探針測試技術是半導體工業檢測電阻率時採用最為廣泛的測試手段之一。隨著時代的不斷進步，半導體產業飛速發展，以單晶矽片為襯底的集成電路集成度越來越高，目前正進入甚大規模集成電路（ ulsi ）時代，測試在整個集成電路生產過程中的地位越來越重要。
  19. Production in ic, semi - conductor, ic chip, wafer, lcd, embedded systems, electronic components and other it components etc

    集成電路，半導體，集成電路晶元，晶片， lcd ，嵌入系統，電子元件和其他它it部件的生產。
  20. The design of cdma terminal chip is a very actual value and extensive application problem in the field of cdma technology application. with the development of micro - electronics technology, the design of integrated circuit has stepped into the age of soc ( system on chip ), which provide a brand - new method for cdma communication system project. in this paper, a design of cdma2000 1x spread modulation soc has be researched with large scale field programmle gate array device, and make a certain results

    Cdma終端晶元設計是cdma技術應用領域中一個具有重要實際應用價值和廣闊應用前景的研究課題。隨著微電子技術的發展，集成電路設計進入了片上系統時代，這為cdma移動通信系統設計提供了一個全新的技術手段。本文將基於cdma技術，用大規模可編程邏輯器件對第三代移動通信cdma20001x的擴頻調製片上系統設計做了進一步的探討和研究，並取得了一定的成果。
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