surface mounted 中文意思是什麼

surface mounted 解釋
掛裝
  • surface : n 1 表面；地面；水面；廣場，空地。2 外觀，外表，皮毛。3 【幾】面；切口；【航空】翼面。adj 表面的...
  • mounted : adj. 1. 騎在馬[自行車]上的。2. 裝好在架子上的；貼在襯紙上的,裱上的；鑲嵌的。
  1. Control system for surface mounted bop stacks

    地面防噴器及控制裝置控制裝置
  2. Hydraulic and pneumatic control components of control systems for surface mounted bop stacks

    地面防噴器及控制裝置專用液壓氣動元件
  3. In - circuit testers can now also test for solder opens on surface - mounted devices ( smds ), a common manufacturing defect on boards with smds

    對于表面安裝設備來說，焊接開路是一個很普遍的製造缺陷，在線測試設備可以將其測試出來。
  4. Mechanical standardization of semiconductor devices - part 6 - 1 : general rules for the preparation of outline drawings of surface mounted semiconductor device parkages - design guide for gull - wing lead terminals

    半導體器件的機械標準化.第6 - 1部分:半導體器件包裝用表面安裝略圖制備的一般規則.鷗型翼引線終端的設計指南
  5. Surface mounted piezoelectric devices for frequency control and selection - standard outlines and terminal lead connections - hybrid enclosure outlines

    頻率控制和選擇用表面安裝的壓電器件.標準外形和端頭連接器.混合外殼輪廓圖
  6. Surface mounted piezoelectric devices for frequency control and selection - standard outlines and terminal lead connections - part 4 : hybrid enclosure outlines

    頻率控制和選擇用表面安裝的壓電器件.標準外形和端頭連接器.第4部分:混合外殼輪廓圖
  7. Mechanical standardization of semiconductor devices - part 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages

    半導體器件的機械標準化.第6部分:表面安裝半導體器件封裝輪廓圖繪制的一般規則
  8. Zno varistors have been widely used in electronic and electrical power devices and systems because of excellent nonlinear v - i characteristics and high absorbance of electric current surges. with the smt ( surface mounted technology ) development, traditional zno varistors can not meet the multilayer thin films lamination structure nappe varistor ceramics and metal electrode low temperature co - fire need. however, the best character of zno - v2o5 varistor can sinter in common furnace during lower temperature ( 900 ), not only settling the problem relate to upon, but also saving energy sources

    Zno壓敏電阻因其優異的v ? i非線性和較高的浪涌吸收能力而廣泛應用在電子、電力設備系統上。然而，隨著表面貼裝技術（ smt ）的發展，傳統的zno壓敏陶瓷不能滿足多層膜獨石結構疊層壓敏電阻元件陶瓷與金屬電極低溫共燒的需要。而zno ? v2o5系壓敏陶瓷的最大優點是能用普通燒結爐在較低溫度（ 900 ）下燒結，不僅解決了以上問題，還大大節約了能源。
  9. A plate for connecting data and voice connectors to a cabling system. it may be wall mounted or surface mounted

    將數據和話音連接器連接到電纜系統的一種板片，它可安裝在墻上或平面上。
  10. Standard practice for leak detection and location using surface - mounted acoustic emission sensors

    使用表面安裝的聲輻射探測器作泄漏探測和定位的標準實施規程
  11. Mechanical standardization of semiconductor devices - part 6 - 5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch ball grid array

    半導體器件的機械標準化.第6 - 5部分:表面安裝半導體器件外殼外形圖繪制的一般規則.小螺距刃片柵格排列的設計指南
  12. Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine pitch land grid array

    半導體器件的機械標準化.第6 - 6部分:平面式安裝半導體器件外殼外形圖繪制的一般規則.小螺距刃片柵格排列的設計指南
  13. Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine pitch land grid array

    半導體器件的機械標準化.第6 - 6部分:半導體器件包裝用表面安裝略圖制備的一般規則.小螺距刃片柵格排列的設計指南
  14. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack

    半導體器件的機械標準化.表面安裝半導體器件封裝外形圖繪制一般規則.玻璃密封陶瓷方型扁平封裝設計指南
  15. G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack

    半導體器件的機械標準化.第6 - 8部分:半導體器件包裝用表面安裝略圖制備的一般規則.玻璃密封的陶瓷四方塊的設計指南
  16. G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for glass sealed ceramic quad flatpack

    半導體器件的機械標準化.第6 - 8部分:表面安裝半導體器件封裝外形圖繪制的一般規則.玻璃密封的陶瓷四邊形扁平組件的設計指南
  17. Mechanical standardization of semiconductor devices - part 6 - 12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitch grid array - rectangular type

    半導體裝置的機械標準化.第6 - 12部分:表面安裝半導體裝置外形圖繪制的一般規則.小節距柵極矩陣列的設計指南.矩形
  18. Mechanical standardization of semiconductor devices - part 6 - 12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch land grid array ; rectangular type

    半導體器件的機械標準化.第6 - 12部分:表面安裝半導體器件封裝外形圖繪制的一般規則.小節距柵極矩陣列的設計指南
  19. Building hardware - controlled door closing devices with hydraulic damping - part 1 : surface mounted door closer with crank drive and spiral spring pot - type door closer

    建築五金.受控門鎖.第1部分:用曲軸傳動和螺旋彈簧的
  20. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for gull - wing lead terminals

    半導體器件的機械標準化.表面安裝的半導體器件封裝外形圖繪制的一般規則.海鷗翼式鉛端子的設計指南
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