組裝微型模件 的英文怎麼說

中文拼音 [zǔzhuāngwéixíngmójiàn]
組裝微型模件 英文
assembled micromodule
  • 組 : Ⅰ名詞1 （由不多的人員組成的單位） group 2 （姓氏） a surname Ⅱ動詞（組織） organize; form Ⅲ量詞（...
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 模 : 模名詞1. （模子） mould; pattern; matrix 2. （姓氏） a surname
  • 件 : Ⅰ量詞（用於個體事物） piece; article; item Ⅱ名詞1. （指可以一一計算的事物） 2. （文件） letter; correspondence; paper; document
  • 組裝 : package; assembling; packaging組裝車間 composing room; 組裝船 fabricated ship; 組裝生產 assembly ...
  1. 1. a small and cheap 8 - bit microcontroller is used as control core. all components of the sensor, some of which are necessary for the multiple and intelligent functions, are selected ones with low cost and small package. by designing all auxiliary logic circuits in a complex programmable logic device ( cpld ), and integrating all analog circuits in an application specific ic ( asic ), the size of pcb board is greatly reduced, which make it possible that the pcb can be installed with the displacement detector together

    系統採用小型廉價8位微控制器控制，電路內配置了為實現多功能智能化所必需的硬體，並全部採用低價格、小體積器件，還將所有輔助邏輯電路設計在一片復雜可編程邏輯器件cpld內，所有模擬電路集成於一片專用集成電路asic內，大大縮小了電路板尺寸，再與傳感元件組裝在一起，從而使整個系統在保證智能化功能的前提下，具有體積小、成本低、一體化和抗干擾能力強的特點。
  2. Firstly, the paper introduced the commonly hardware configure of microcomputer relaying and the function of every module of industry controlling computer std90386. secondly, the paper introduced several types busbarprotection which was commonly installed on electric power system and the characteristic of mv or lv system with low current grounding. based on it, the paper put forwards the theory of percentage - restraint differential relay. after that, in the discussing every problems of the relaying working the paper put the emphasis on the negative effect of the ct saturation and countermeasure

    本文首先介紹了微機保護裝置的一般硬體配置以及作為裝置硬體平臺的std90386工控機各組件模板的功能，然後分析了目前電網系統裝設的母線保護的各種類型以及中、低壓小電流接地電網的特點，在此基礎上分析、介紹了作為本保護動作原理的「比率制動式差動保護」原理。
  3. Multichip module ( mcm ) is high - level mode in electronic package. mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate. mcm can meet the demands of compact packaging and high density

    多晶元組件（ mcm ）是微電子封裝的高級形式，它是把裸晶元與微型元件組裝在同一個高密度布線基板上，組成能夠完成一定的功能的模塊甚至子系統。
  4. Abstract : in this article, we discuss the calculation method of the heat analysis in the multilayer rectangular model system when there is heat source in the upper surface of the system. this method can be used in the heat analysis of the design of integrated circuit, micro - electrical assembly unit, etc

    文摘:研究上表面含熱源的多層矩形模型半解析的熱分析計算方法.該計算方法可以用於集成電路、混合電路和微電子組裝件的熱設計工作
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