Using jgp560c magnetron sputtering equipment, cu / ag film are deposited on cd1 - xznxte substrate by dc magnetron sputtering in order to get the influences of the main experiments parameters such as sputtering power, gas flow, vacuum air pressure, magnetoelectricity power and substrate temperature on deposition rate of film, discovered that dc sputtering power is the most key factor influencing the deposition rate
在jgp560c型超高真空多功能磁控
濺射
鍍膜機上，採用直流磁控
濺射法在cdznte晶體上制備出cu ag合金薄膜，揭示了氣體流量、直流
濺射功率、勵磁電源功率、工作氣壓和襯底溫度等工藝參數對沉積速率的影響規律。結果表明
濺射功率對沉積速率的影響最大，隨
濺射功率的增大沉積速率快速增大。
Compound medium wave - guide film on columned li - ferrites was made by magnetron sputtering system
用磁控
濺射的方法在圓柱鋰鐵氧體表面
鍍覆了復合介質波導薄膜。
J. r. stevens et al., “ electrochromism of wo3 - based films in contact with a solid li - doped siloxane elastomer electrolyte, ” applied optics, 26, pp. 3489 - 3490, 1987
鄭耀爵， 「以離子束
濺鍍法制備氧化銦錫薄膜之光學、電學及可靠性質之研究， 」國立成功大學，碩士論文， 2003 。
High quality nickel films have been successfully plated on cenosphere particles by dc magnetron sputtering at mom temperature
摘要本文論述了在空心微珠表面磁控
濺射
鍍金屬薄膜的方法。
The zircondri filin wtut rirconia wa prepared and the removing technology of the zirconia on the zirconium sdrices was obtalned. the methods of chemistry and magnetron sputtring plating were used in order to platc a palladium film, which is characteristic of self catalysis for hydrogen and the sole h - permselectivity on the clean rirconium sdrices prepared by the methods of electrochemitw and ( or ) high temperatur vacuum hydrgenization, which was firstly studied. the plating tedrilogy was obained and the surface modified zirconium membran was prepared
在利用電化學法和真空高溫除氧加氫法去除了鋯表面氧化膜的基礎上，分別採用化學法、磁控
濺射法兩種
鍍膜技術在其表面上
鍍上了一層對氫具有自催化分解、唯一選擇滲透性的金屬鈀膜，首次獲得了鋯基材膜表面上
鍍鈀的制備工藝，成功制備了鋯表面改性選擇滲氫膜。
The results show that proper control the motion mode of the particle in plating results in many strengths of the nickel films, such as good uniformity, high compactness, and strong interfacial adhesion
濺射
鍍膜時，通過控制空心微珠的運動方式，在空心微珠表面沉積了一層均勻性好、附著力強和緻密性好的金屬鎳膜。
Our factory specializes in manufacturing cabinet vacuum coaters, magnetic control sputter coaters and vacuum exhaust equipments, industrial boiler, all kinds of valves, coaters and press packer specially used in the industry of quartz crystal
我廠是國內專業生產箱式真空
鍍膜機、磁控
濺射
鍍膜機、真空排氣設備、石英晶體行業專用被銀機和壓封機、工業爐及各種真空閥門設計製造的專業廠家。
Rf diode sptuttering system
高頻二極體
濺鍍系統
It make possible for the system to set and to change source current ( which is proportional to evaporation rate from the ms source ) during coating process
在
鍍膜過程中，保證了每個磁控
濺射靶上電流的穩定控制和精確調整。
Uniform and compact plzt and sno _ 2 ceramic targets, which diameter were 212mm and 221mm, respectively, had been successfully fabricated. ( 2 ) a rotating magnetic field rf magnetron sputtering system had been designed and set up, which showed high utilization efficiency of target, high films uniformity, and high deposition rate, etc. ( 3 ) the plzt and sno _ 2 thin films were investigated by afm, xrd, sem, and spectral photometer. the optimized processing parameters of preparing these films had been found
並以此為基礎分別制備了緻密、均勻、平整、直徑為212mm的plzt和221mm的sno _ 2陶瓷
濺射靶材; （ 2 ）為克服現有磁控
濺射設備的不足，提出了一種新的磁控
濺射方案，採用該方案的設備具有:靶材利用率高、
鍍膜均勻、成膜速度快等特點; （ 3 ）運用afm 、 xrd 、 sem以及雙光路分光光度計等分析手段對plzt和sno _ 2薄膜的微結構和性能進行研究，找到了制備plzt電光薄膜和sno2透明電極材料的最佳工藝條件。
Ion sputtering coator
離子
濺射
鍍膜臺
Sputtering name plate can stand the character of scratch and strength, fine metallic sense, so it is widely used in the lens panel of cell phones and digital cameras
濺鍍銘板表面耐刮傷，強度夠，金屬質感佳的特性，廣泛用於手機，數位相機的lens面板上，最佳的選擇。
Planar magnetron sputtering system
平面磁控管
濺鍍系統
Dc diode sputtering system
直流二極體
濺鍍系統
Magnetron sputtering system
磁控管
濺鍍系統
Reactive sputtering system
反應性
濺鍍系統
Ion beam sputtering system
離子束
濺鍍系統
Reactive sputter etching system
反應性
濺鍍蝕刻系統
Surface chemical analysis - sputter depth profiling - optimization using layered systems as reference materials
表面化學分析.濺鍍深度造型.利用分層系統作為標準物質的優選法
